XCV400E-8FG676C

The XCV400E-8FG676C is a Virtex®-E field programmable gate array (FPGA) in a 676‑ball BGA package. It provides a high I/O count and on-chip memory with a 1.8 V internal core supply, making it suitable for I/O‑dense and memory‑assisted digital designs.

This device targets applications that require substantial programmable logic, flexible I/O standards and integrated clock and memory resources, delivering a balance of performance and integration for commercial-temperature systems.

Key Features

• Programmable Logic — 10,800 logic elements and 2,400 CLBs provide significant capacity for custom digital logic and control functions.
• Embedded Memory — Approximately 0.16 Mbits (163,840 bits) of on‑chip RAM to support buffering, small data stores, and scratchpad memory.
• I/O Density — 404 user I/O pins enabling high‑pincount interfaces and parallel connections for high bandwidth designs.
• Gate Count — 569,952 equivalent gates for sizing and system partitioning considerations.
• Core Voltage — VCCINT range 1.71 V to 1.89 V for the 1.8 V Virtex‑E core.
• Package & Mounting — 676‑FBGA (27 × 27 mm) surface‑mount package offering a compact high‑density footprint.
• Operational Range — Commercial grade operation from 0 °C to 85 °C.
• Family-Level Capabilities (from Virtex‑E) — Family features include high‑performance SelectI/O+ technology, differential signalling support (LVDS, BLVDS, LVPECL), multiple DLLs for clock management, and PCI‑compliant interfaces as documented for Virtex‑E devices.
• Compliance — RoHS‑compliant device construction.

Typical Applications

• High‑speed I/O Interfaces — Leverage the 404 I/Os and SelectI/O+ technology for demanding parallel and differential interface implementations.
• Custom Logic and Control — Implement protocol offload, glue logic, and control state machines using the 10,800 logic elements and 2,400 CLBs.
• Memory‑assisted Data Paths — Use the on‑chip RAM to implement small FIFOs, buffering and data staging in mid‑range performance designs.
• PCI and Bus Bridging — Family-level PCI support and programmable I/O standards enable integration into bus interface and bridging functions.

Unique Advantages

• High Logic and I/O Integration: Combines 10,800 logic elements with 404 I/Os to reduce external glue logic and simplify board-level design.
• Flexible I/O Standards: Family support for a wide range of single‑ended and differential I/O standards enables reuse across multiple interface requirements.
• Compact, High‑Density Packaging: 676‑ball FBGA (27 × 27 mm) package balances pin density with board area efficiency for space-constrained designs.
• On‑chip Memory for Local Storage: Approximately 0.16 Mbits of embedded RAM supports buffering and local data operations without external memory for small to medium buffering needs.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation for use in commercial‑grade environments.

Why Choose XCV400E-8FG676C?

The XCV400E-8FG676C offers a practical combination of logic capacity, I/O density and on‑chip memory in a compact 676‑BGA package. Its 1.8 V Virtex‑E core characteristics and family features—such as advanced I/O support and clock management circuitry—make it a strong choice for designers building I/O‑centric, mid‑complexity programmable systems at commercial temperatures.

Choose this device when you need a balance of programmable logic, flexible interfacing and integrated memory resources backed by a well‑documented device family for development and system integration.

Request a quote or submit an inquiry to check availability and pricing for the XCV400E-8FG676C today.