XCV405E-6BG560I

The XCV405E-6BG560I is a Virtex-E field programmable gate array (FPGA) in a 560-LBGA exposed pad metal package designed for surface-mount applications. It integrates up to 10,800 logic elements and approximately 0.57 Mbits of embedded RAM to support complex programmable logic implementations.

With 404 user I/O, 129,600 gates and an industrial operating range from -40 °C to 100 °C, this device is suited to designs that require high I/O count, significant on-chip logic and robust temperature tolerance. It operates from a core supply between 1.71 V and 1.89 V and is RoHS compliant.

Key Features

• Logic Capacity — 10,800 logic elements provide the programmable logic resources needed for medium-density FPGA designs.
• Embedded Memory — Approximately 0.57 Mbits of on-chip RAM for buffering, state storage and local data processing.
• I/O Resources — 404 user I/O pins to support wide parallel interfaces, multiple peripherals and extensive board connectivity.
• Gate Count — 129,600 gates for implementing combinational and sequential logic structures.
• Package and Mounting — 560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) optimized for surface-mount assembly and thermal conduction.
• Power — Core voltage supply range of 1.71 V to 1.89 V for compatibility with targeted power domains.
• Operating Temperature — Rated for -40 °C to 100 °C to meet industrial temperature requirements.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Use where extended temperature range and up to 404 I/O lines are needed for motor control, PLC interfaces or factory automation I/O aggregation.
• Communications & Networking — Implement medium-density protocol processing, parallel interface bridging and control plane logic using 10,800 logic elements and substantial I/O.
• Embedded Processing & Prototyping — Deploy for custom logic prototypes and embedded controllers that require on-chip RAM and gate resources for state machines and buffering.

Unique Advantages

• Balanced Logic-to-Memory Ratio: The combination of 10,800 logic elements and approximately 0.57 Mbits of embedded RAM enables mixed logic and data-path designs without immediate external memory dependence.
• High I/O Count: 404 user I/Os simplify board-level integration for parallel interfaces, sensor arrays or multi-channel data acquisition.
• Industrial Temperature Rating: -40 °C to 100 °C supports deployments in demanding thermal environments.
• Robust Package Thermal Path: Exposed-pad 560-LBGA metal package and large 42.5 × 42.5 mm footprint help with thermal management in dense designs.
• RoHS Compliant: Meets environmental compliance requirements for modern assembly processes.

Why Choose XCV405E-6BG560I?

The XCV405E-6BG560I delivers a practical balance of logic capacity, embedded memory and extensive I/O in an industrial-temperature, surface-mount 560-LBGA package. It is suited for engineers developing medium-density programmable logic solutions that require reliable operation across a wide temperature range and significant on-chip resources.

Designed for applications that need scalable logic, plentiful I/O and attention to thermal and assembly considerations, this Virtex-E FPGA offers a clear value proposition for industrial and embedded system designs where verified specifications and RoHS compliance are important.

Request a quote or submit your requirements to receive pricing and availability for the XCV405E-6BG560I.