XCV405E-7BG560I

The XCV405E-7BG560I is a Virtex®-E EM Field Programmable Gate Array (FPGA) from AMD, supplied in a 560-LBGA exposed pad metal package. It provides a combination of programmable logic, on-chip embedded memory and a high I/O count for industrial-grade embedded designs.

This device integrates 10,800 logic elements, approximately 0.57 Mbits of embedded memory (573,440 total RAM bits) and 404 user I/O, making it suitable for designs that require substantial on-chip resources within a compact surface-mount package. It operates from a 1.71 V to 1.89 V supply and is specified for an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity — 10,800 logic elements provide programmable fabric for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 0.57 Mbits (573,440 bits) of on-chip RAM to support data buffering, FIFOs and small lookup tables without external memory.
• I/O Resources — 404 user I/O pins to interface with peripherals, sensors and system buses within a single device.
• Gate Count — 129,600 gates for overall device complexity and integration capability.
• Power — Core supply range of 1.71 V to 1.89 V to match system power-rail requirements for the FPGA core.
• Package and Mounting — 560-LBGA exposed pad, metal package (supplier device package: 560-MBGA, 42.5 × 42.5 mm) optimized for surface-mount PCB assembly.
• Temperature and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for harsh-environment applications.
• Compliance — RoHS compliant, supporting environmental regulation requirements.

Unique Advantages

• High integration density: 10,800 logic elements and 129,600 gates allow consolidation of multiple functions onto a single FPGA, reducing overall BOM and board complexity.
• On-chip memory for system performance: Approximately 0.57 Mbits of embedded RAM enables local buffering and data manipulation without immediate reliance on external memory devices.
• Extensive connectivity: 404 I/O pins provide flexibility for interfacing with a wide range of peripherals and subsystems.
• Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in demanding thermal environments.
• Compact, manufacturable package: 560-LBGA exposed pad, metal package (560-MBGA, 42.5 × 42.5 mm) compatible with standard surface-mount assembly processes.
• Regulatory compliance: RoHS compliance simplifies environmental qualification and end-product regulatory alignment.

Why Choose XCV405E-7BG560I?

The XCV405E-7BG560I positions itself as a versatile, industrial-grade Virtex®-E FPGA option for engineers who need a balanced mix of logic resources, embedded memory and a high I/O count in a compact, surface-mount package. Its supply voltage range and operating temperature window make it suitable for robust embedded applications where on-chip integration can reduce system complexity.

This device is appropriate for design teams and procurement groups seeking an FPGA with established logic capacity, meaningful embedded RAM and extensive I/O, backed by AMD’s Virtex®-E family lineage. Its package and RoHS compliance support streamlined manufacturing and regulatory readiness.

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