XCV50-4BG256I

IC FPGA 180 I/O 256BGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 180 32768 1728 256-BBGA

Quantity 251 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BBGANumber of I/O180Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells1728
Number of Gates57906ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XCV50-4BG256I – Virtex® Field Programmable Gate Array (FPGA) IC 180 32768 1728 256-BBGA

The XCV50-4BG256I is an SRAM-based Virtex FPGA offering a high-density, reprogrammable logic platform tailored for industrial applications. It provides 57,906 system gates and 1,728 logic elements in a 256-BBGA surface-mount package for compact system integration.

Designed for applications that require flexible on-chip memory, extensive I/O, and advanced clock management, this device delivers deterministic system-level capabilities with on-chip block RAM and configurable logic resources.

Key Features

  • Core Logic  1,728 logic elements (CLBs) delivering 57,906 system gates for implementing mid-density programmable logic functions.
  • Embedded Memory  32,768 bits of on-chip block RAM and support for SelectRAM+ topologies for flexible, hierarchical memory architectures.
  • I/O Capacity  180 user I/O pins to support a broad range of external interfaces and parallel/serial connectivity needs.
  • Clocking and Timing  Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock distribution and control.
  • Arithmetic and Routing  Dedicated carry logic and multiplier support together with abundant registers and cascade chains for implementing high-speed arithmetic and wide functions.
  • Configuration and Reprogrammability  SRAM-based architecture with multiple programming modes and in-system re-programmability for design iteration and field updates.
  • Package and Mounting  256-BBGA (256-PBGA, 27×27) surface-mount package suitable for compact PCB designs.
  • Power and Environmental Range  Supply voltage range 2.375 V to 2.625 V and an operating temperature range of −40°C to 100°C; RoHS compliant.
  • Performance  Series-level characteristics include system performance up to 200 MHz and 66-MHz PCI compliance as documented for the Virtex family.

Typical Applications

  • PCI and Compact PCI systems  Use the device’s 66‑MHz PCI compliance and hot‑swappable support for Compact PCI host/interface functions and mid-speed bus bridging.
  • Embedded logic and control  Implement control, glue-logic, and protocol handling where 1,728 logic elements and on-chip RAM provide flexible, reprogrammable functionality.
  • Memory interface and buffering  Leverage the hierarchical memory system and fast external RAM interfaces for buffering, packet handling, and intermediate data storage.
  • Clocked high-performance subsystems  Apply the DLLs and multi-level clock networks for deterministic timing in synchronous data paths and timing-critical logic.

Unique Advantages

  • Reprogrammable system flexibility: SRAM-based in-system configuration enables design updates and multiple programming modes for development and field serviceability.
  • Balanced performance and capacity: 57,906 system gates with 1,728 logic elements and 32,768 bits of block RAM provide a balanced mix of logic and embedded memory for mid-range designs.
  • Advanced clock management: Four DLLs plus dedicated global and local clock nets simplify clock distribution and reduce skew for synchronous designs.
  • Industrial temperature range: Qualified for −40°C to 100°C operation to meet temperature demands of industrial applications.
  • High I/O count in a compact package: 180 I/O pins in a 256-BBGA package enable dense connectivity while keeping board footprint minimal.
  • Vendor development support: Supported by the Virtex development ecosystem and Foundation/Alliance tools for design entry, synthesis, and implementation.

Why Choose XCV50-4BG256I?

The XCV50-4BG256I positions itself as a reliable, mid-density programmable logic device for industrial designs that require reprogrammability, moderate gate density, and a compact package. With a mix of logic resources, on-chip memory, comprehensive clocking, and a 180-pin I/O footprint, it is suitable for projects needing flexible hardware customization and iterative design cycles.

Its industrial temperature rating, RoHS compliance, and support within the Virtex family development tools deliver a practical platform for engineering teams focusing on control, interface, and data-path implementations that benefit from in-system configurability and proven FPGA architecture.

Request a quote or submit an RFQ to receive pricing and availability information for the XCV50-4BG256I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up