XCV50-4BG256I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 180 32768 1728 256-BBGA |
|---|---|
| Quantity | 251 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 180 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 57906 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of XCV50-4BG256I – Virtex® Field Programmable Gate Array (FPGA) IC 180 32768 1728 256-BBGA
The XCV50-4BG256I is an SRAM-based Virtex FPGA offering a high-density, reprogrammable logic platform tailored for industrial applications. It provides 57,906 system gates and 1,728 logic elements in a 256-BBGA surface-mount package for compact system integration.
Designed for applications that require flexible on-chip memory, extensive I/O, and advanced clock management, this device delivers deterministic system-level capabilities with on-chip block RAM and configurable logic resources.
Key Features
- Core Logic 1,728 logic elements (CLBs) delivering 57,906 system gates for implementing mid-density programmable logic functions.
- Embedded Memory 32,768 bits of on-chip block RAM and support for SelectRAM+ topologies for flexible, hierarchical memory architectures.
- I/O Capacity 180 user I/O pins to support a broad range of external interfaces and parallel/serial connectivity needs.
- Clocking and Timing Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock distribution and control.
- Arithmetic and Routing Dedicated carry logic and multiplier support together with abundant registers and cascade chains for implementing high-speed arithmetic and wide functions.
- Configuration and Reprogrammability SRAM-based architecture with multiple programming modes and in-system re-programmability for design iteration and field updates.
- Package and Mounting 256-BBGA (256-PBGA, 27×27) surface-mount package suitable for compact PCB designs.
- Power and Environmental Range Supply voltage range 2.375 V to 2.625 V and an operating temperature range of −40°C to 100°C; RoHS compliant.
- Performance Series-level characteristics include system performance up to 200 MHz and 66-MHz PCI compliance as documented for the Virtex family.
Typical Applications
- PCI and Compact PCI systems Use the device’s 66‑MHz PCI compliance and hot‑swappable support for Compact PCI host/interface functions and mid-speed bus bridging.
- Embedded logic and control Implement control, glue-logic, and protocol handling where 1,728 logic elements and on-chip RAM provide flexible, reprogrammable functionality.
- Memory interface and buffering Leverage the hierarchical memory system and fast external RAM interfaces for buffering, packet handling, and intermediate data storage.
- Clocked high-performance subsystems Apply the DLLs and multi-level clock networks for deterministic timing in synchronous data paths and timing-critical logic.
Unique Advantages
- Reprogrammable system flexibility: SRAM-based in-system configuration enables design updates and multiple programming modes for development and field serviceability.
- Balanced performance and capacity: 57,906 system gates with 1,728 logic elements and 32,768 bits of block RAM provide a balanced mix of logic and embedded memory for mid-range designs.
- Advanced clock management: Four DLLs plus dedicated global and local clock nets simplify clock distribution and reduce skew for synchronous designs.
- Industrial temperature range: Qualified for −40°C to 100°C operation to meet temperature demands of industrial applications.
- High I/O count in a compact package: 180 I/O pins in a 256-BBGA package enable dense connectivity while keeping board footprint minimal.
- Vendor development support: Supported by the Virtex development ecosystem and Foundation/Alliance tools for design entry, synthesis, and implementation.
Why Choose XCV50-4BG256I?
The XCV50-4BG256I positions itself as a reliable, mid-density programmable logic device for industrial designs that require reprogrammability, moderate gate density, and a compact package. With a mix of logic resources, on-chip memory, comprehensive clocking, and a 180-pin I/O footprint, it is suitable for projects needing flexible hardware customization and iterative design cycles.
Its industrial temperature rating, RoHS compliance, and support within the Virtex family development tools deliver a practical platform for engineering teams focusing on control, interface, and data-path implementations that benefit from in-system configurability and proven FPGA architecture.
Request a quote or submit an RFQ to receive pricing and availability information for the XCV50-4BG256I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








