XCV405E-7FG676C

The XCV405E-7FG676C is a Virtex®-E field programmable gate array (FPGA) IC designed for board-level integration where programmable digital logic and embedded memory are required. It combines a mid-range logic capacity with on-chip RAM and a high I/O count in a 676-ball BGA package for compact system designs.

Key Features

• Logic Capacity  Approximately 10,800 logic elements provide a balance of combinational and sequential resources for custom digital designs.
• Configurable Logic Blocks (CLBs)  2,400 CLBs available to structure logic functions across the device.
• Embedded Memory  Approximately 0.57 Mbits of on-chip RAM to support FIFOs, buffering, and small data storage without external memory.
• I/O Density  404 user I/O pins enable interfacing with multiple peripherals and high-pin-count connectors.
• Gate Equivalent  About 129,600 gate equivalents for system-level capacity planning and integration.
• Package  676‑ball FBGA (27 × 27) surface-mount package for compact board footprint and robust solder mounting.
• Power  Core supply voltage range of 1.71 V to 1.89 V to match system power rails and design constraints.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C for standard ambient environments.
• Compliance  RoHS‑compliant material composition for regulatory and manufacturing consistency.

Typical Applications

• Custom Digital Logic  Implement application-specific state machines, protocol handlers, and glue logic using the device’s logic elements and CLBs.
• Embedded Memory Functions  Use the on-chip RAM for buffering, small-scale data storage, and FIFO implementations without external memory.
• High‑Pin-Count Interfaces  Leverage 404 I/O pins to connect multiple peripherals, high-speed connectors, or expansion interfaces on a single board.
• Board-Level Integration  676‑FBGA package and surface-mount mounting simplify dense PCB layouts where board space is at a premium.

Unique Advantages

• Balanced Logic and Memory:  Combination of approximately 10,800 logic elements and 0.57 Mbits of embedded RAM helps consolidate functions that would otherwise require separate components.
• High I/O Count:  404 user I/Os reduce the need for external multiplexing, simplifying system routing and connector usage.
• Compact Packaging:  676‑ball FBGA (27 × 27) offers a high-density solution for compact or multi‑layer PCBs.
• Defined Power Envelope:  Narrow core voltage range (1.71 V–1.89 V) supports predictable power-supply design and margin planning.
• RoHS Compliance:  Meets RoHS requirements for materials, aiding regulatory alignment in manufacturing.

Why Choose XCV405E-7FG676C?

The XCV405E-7FG676C positions itself as a mid-range Virtex®-E FPGA option that pairs a substantial logic fabric with embedded RAM and a high I/O count in a compact 676‑FBGA package. It is suited to designers seeking to integrate multiple digital functions and moderate memory requirements onto a single programmable device while maintaining a small PCB footprint.

This device is appropriate for commercial‑temperature designs that require predictable power rails and RoHS‑compliant components. Its combination of logic elements, CLBs, embedded RAM, and extensive I/O makes it a practical choice for board-level digital integration and system prototyping.

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