XCV405E-6FG676C

The XCV405E-6FG676C is a Virtex®-E EM Field Programmable Gate Array from AMD, delivering a mid-range complement of configurable logic, embedded memory and I/O density in a compact BGA package. It integrates 10,800 logic elements, approximately 0.57 Mbits of embedded RAM (573,440 bits) and 404 user I/O pins, making it suitable for commercial electronic designs that require moderate logic capacity and substantial connectivity.

Designed for surface-mount assembly, the device operates from a core supply range of 1.71 V to 1.89 V and is specified for commercial temperature operation from 0 °C to 85 °C. The package is a 676-ball FBGA (27 × 27) and the device is RoHS compliant.

Key Features

• Logic Capacity  Provides 10,800 logic elements to implement a wide range of combinational and sequential logic functions.
• On-chip Memory  Approximately 0.57 Mbits of embedded RAM (573,440 bits) for data buffering, state storage and small lookup tables.
• I/O Count  404 user I/O pins for extensive external interfacing and parallel signal connections.
• Gate Count  Approximately 129,600 gates indicating the scale of integrated logic resources.
• Core Voltage  Specified core supply range of 1.71 V to 1.89 V to match system power rails.
• Package and Mounting  676-BGA (supplier package: 676-FBGA, 27 × 27) in a surface-mount format for compact board integration.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard electronics environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

• Balanced logic and memory mix: The combination of 10,800 logic elements and roughly 0.57 Mbits of on-chip RAM supports a variety of digital functions without immediate need for large external memory.
• High I/O density: 404 I/O pins provide flexibility to interface multiple peripherals, buses and external devices directly.
• Compact BGA packaging: The 676-FBGA (27 × 27) package enables a small PCB footprint while supporting high pin counts for dense system designs.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with mainstream electronic product requirements.
• RoHS compliance: Conforms to common environmental standards for lead-free assembly and shipment.
• Surface-mount compatibility: Designed for standard surface-mount manufacturing processes to simplify production integration.

Why Choose XCV405E-6FG676C?

The XCV405E-6FG676C positions itself as a practical Virtex®-E FPGA option when you need a balanced mix of logic, on-chip memory and I/O in a compact package. Its 10,800 logic elements, substantial I/O count and integrated RAM make it suitable for commercial electronic designs that require configurable logic and moderate on-chip resources while maintaining a small board footprint.

Choosing this FPGA delivers a combination of integration and predictable electrical and thermal characteristics—core voltage range, package type and operating temperature—that help streamline system design and manufacturing for commercial applications.

Request a quote or submit an inquiry to obtain pricing, availability and additional procurement details for the XCV405E-6FG676C.