XCV405E-6BG560C

The XCV405E-6BG560C from AMD is a Virtex®-E EM family field programmable gate array supplied in a 560‑LBGA exposed pad metal package. It provides a mid-range programmable logic resource with 10,800 logic elements and approximately 0.57 Mbits of embedded memory for on-chip data storage.

With 404 user I/O pins, a gate count of 129,600, and a supplier package dimension of 42.5 × 42.5 mm, this commercial‑grade FPGA is suited for commercial embedded designs requiring substantial logic density in a compact surface-mount form factor.

Key Features

• Core Logic 10,800 logic elements provide programmable fabric for implementing custom logic, state machines, and datapaths.
• Embedded Memory Approximately 0.57 Mbits of on-chip RAM for buffering, FIFOs, and small data tables directly inside the FPGA.
• I/O and Gate Capacity 404 user I/O pins and a total gate count of 129,600 support complex interfacing and sizeable logic implementations.
• Package 560‑LBGA exposed pad, metal package (supplier package: 560‑MBGA, 42.5 × 42.5 mm) optimized for surface-mount assembly and thermal management via the exposed pad.
• Power Core supply range from 1.71 V to 1.89 V, enabling straightforward power sequencing and supply design for the FPGA core.
• Temperature and Grade Commercial operating temperature range of 0 °C to 85 °C and rated for commercial-grade applications.
• Compliance RoHS compliant to meet common lead‑free manufacturing requirements.

Typical Applications

• FPGA-based prototyping — Use the device for system-level hardware validation and proof-of-concept designs that require substantial logic and I/O resources.
• Embedded control and acceleration — Implement custom control logic, hardware accelerators, or signal processing blocks that benefit from on-chip memory and programmable logic.
• High-density I/O interfacing — Leverage 404 I/Os for bridging, protocol conversion, and board-level integration where multiple signals and buses must be handled.

Unique Advantages

• High logic capacity: 10,800 logic elements allow implementation of complex logic functions without immediate need for higher-tier devices.
• Substantial on-chip memory: Approximately 0.57 Mbits of embedded RAM supports buffering and data storage close to logic, reducing external memory dependence.
• Large I/O count: 404 user I/Os enable dense board-level connectivity for mixed-signal interfaces and multi-bus systems.
• Compact, thermally-aware package: 560‑LBGA with an exposed pad and 42.5 × 42.5 mm supplier package footprint simplifies PCB layout and thermal considerations for surface-mount designs.
• Tight core voltage window: A defined supply range of 1.71 V to 1.89 V supports controlled power design and predictable core behavior.
• RoHS compliant: Meets lead‑free manufacturing requirements for commercial production environments.

Why Choose XCV405E-6BG560C?

The XCV405E-6BG560C positions itself as a commercially graded, mid-range Virtex®-E FPGA that balances logic density, embedded memory, and extensive I/O in a single surface-mount package. Its combination of 10,800 logic elements, approximately 0.57 Mbits of on-chip RAM, and 404 I/Os makes it suitable for designers who need programmable flexibility and compact packaging for commercial embedded systems.

Choose this device when your design requires a reliable FPGA option with significant on-chip resources and a package designed for practical PCB integration and thermal handling. Its specifications support scalable designs where integration and predictable electrical and thermal characteristics are important.

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