XCV405E-6FG676I

The XCV405E-6FG676I is a Virtex®-E EM field programmable gate array (FPGA) from AMD, offered in a 676-ball BGA package. It provides a combination of programmable logic, embedded memory, and a high I/O count suitable for industrial-grade electronic systems.

With approximately 10,800 logic elements, about 0.57 Mbits of embedded memory and 404 I/O, this device targets designs that require on-chip logic resources, significant I/O connectivity and extended temperature operation.

Key Features

• Core Logic  Approximately 10,800 logic elements and 129,600 equivalent gates for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 0.57 Mbits (573,440 bits) of on-chip RAM for buffering, lookup tables and small data storage.
• I/O Capacity  404 user I/O pins to support wide parallel interfaces and multiple external peripherals.
• Power  Core supply voltage range of 1.71 V to 1.89 V to match targeted FPGA power domains and system designs.
• Package & Mounting  676-ball BGA (supplier package: 676-FBGA, 27×27 mm) in a surface-mount form factor for compact board integration.
• Operating Range & Grade  Industrial grade device rated for operation from −40°C to 100°C, supporting deployment in temperature-challenging environments.
• Environmental Compliance  RoHS-compliant construction for regulatory and manufacturing considerations.

Typical Applications

• Industrial control and automation  Industrial-grade temperature range and high I/O count make the device suitable for control logic and interfacing in automation equipment.
• Embedded processing and custom peripherals  On-chip logic elements and embedded RAM support implementation of application-specific processors, protocol bridges and peripheral controllers.
• High-density I/O interface designs  404 I/O pins enable integration with multiple sensors, actuators and parallel buses in compact system designs.
• Prototype and legacy migration  Surface-mount 676-BGA packaging and substantial logic resources can be used for prototyping or replacing custom ASIC logic in industrial systems.

Unique Advantages

• Substantial logic resources: ~10,800 logic elements and 129,600 gates provide the capacity to implement complex digital functions on-chip.
• Embedded memory on board: Approximately 0.57 Mbits of RAM reduces the need for external memory in many control and buffering tasks.
• Large I/O footprint: 404 user I/O pins support multiple parallel interfaces and extensive peripheral connectivity.
• Industrial temperature capability: Rated from −40°C to 100°C for reliable operation in temperature-challenging environments.
• Compact BGA packaging: 676-FBGA (27×27) surface-mount package balances high pin count with PCB area efficiency.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and end-product requirements.

Why Choose XCV405E-6FG676I?

The XCV405E-6FG676I combines a substantial complement of logic elements, embedded memory and a high I/O count in an industrial-grade FPGA package. This positioning makes it suitable for engineers designing industrial systems and embedded platforms that require programmable logic, compact packaging and extended temperature operation.

With a defined core voltage range, surface-mount 676-BGA packaging and RoHS compliance, the device offers a practical balance of integration and environmental readiness for medium-complexity programmable designs where on-chip memory and I/O density are important.

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