XCV405E-8FG676C

The XCV405E-8FG676C is a Virtex®-E EM Field Programmable Gate Array (FPGA) from AMD, delivered in a 676-FBGA (27×27) surface-mount package. It integrates 2,400 CLBs and 10,800 logic elements with approximately 0.57 Mbits of embedded memory and a 404-pin I/O count, providing on-chip resources for complex logic and I/O interfacing.

Designed for commercial-grade applications, this FPGA operates from a 1.71 V to 1.89 V core supply and supports an ambient temperature range of 0 °C to 85 °C. It is RoHS compliant and packaged for high-density board designs requiring a 676-BGA footprint.

Key Features

• Core Logic  2,400 CLBs and 10,800 logic elements enable implementation of complex programmable logic functions.
• Embedded Memory  Approximately 0.57 Mbits of on-chip RAM (573,440 bits) for storage and buffering within logic designs.
• I/O Capacity  404 user I/O pins to support extensive interfacing and signaling requirements.
• Gate Density  129,600 gates to accommodate moderately complex gate-level implementations and glue logic.
• Package & Mounting  676-BGA (supplier device package: 676-FBGA, 27×27) surface-mount package for high pin-count, compact board layouts.
• Power  Core voltage range of 1.71 V to 1.89 V to match system power-rail requirements.
• Operating Conditions & Compliance  Commercial operating temperature 0 °C to 85 °C and RoHS compliant.

Typical Applications

• FPGA Prototyping and Development  Use the device’s 10,800 logic elements and 2,400 CLBs for hardware prototyping and validation of custom logic designs.
• High-Density I/O Systems  The 404 I/O pins support designs that require extensive external interfacing or parallel signal routing.
• Embedded Memory-Dependent Designs  Approximately 0.57 Mbits of on-chip RAM can be applied for buffering, small data tables, or state storage within logic fabrics.
• Compact Board Implementations  The 676-FBGA package is suitable for space-constrained PCBs that need a high pin count in a compact footprint.

Unique Advantages

• Substantial Logic Capacity: 10,800 logic elements and 2,400 CLBs provide the resources needed for medium-to-complex logic implementations without external ASICs.
• Meaningful On-Chip Memory: Approximately 0.57 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
• Large I/O Complement: 404 available I/O pins support extensive peripheral and signaling connectivity directly from the FPGA.
• High Gate Count: 129,600 gates offer the density required for integrating multiple functions on a single device.
• Compact, High-Pin-Count Package: 676-FBGA (27×27) supports high-density board layouts while maintaining a surface-mount form factor.
• Commercial-Grade and RoHS Compliant: Specified 0 °C to 85 °C operation and RoHS compliance fit standard commercial electronic designs and regulatory needs.

Why Choose XCV405E-8FG676C?

The XCV405E-8FG676C positions itself as a commercially graded Virtex®-E FPGA that combines moderate to high logic capacity, significant embedded memory, and a large I/O count in a compact 676-BGA package. Its specification set—2,400 CLBs, 10,800 logic elements, 404 I/O, and approximately 0.57 Mbits of on-chip RAM—makes it suitable for designers seeking to consolidate multiple functions into a single programmable device while maintaining a commercial temperature profile.

This part is well suited to teams developing board-level systems that require a balance of logic density, embedded memory, and high pin-count connectivity in a surface-mount FBGA package from AMD.

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