XCV50-4BG256C

IC FPGA 180 I/O 256BGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 180 32768 1728 256-BBGA

Quantity 27 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BBGANumber of I/O180Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells1728
Number of Gates57906ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XCV50-4BG256C – Virtex Field Programmable Gate Array, 256-BBGA

The XCV50-4BG256C is an SRAM-based Virtex FPGA offering a balanced mix of logic capacity, on-chip memory and I/O density in a 256-ball BGA package. Built on the Virtex architecture, the device exposes approximately 1,728 logic elements, 32,768 bits of on-chip RAM and 180 user I/O pins, targeting commercial designs that require reprogrammable, high‑performance programmable logic.

Designed for applications that require flexible clocking, multi-standard interfaces and in-system reconfiguration, this Virtex device combines core FPGA features — including dedicated clock-management, configurable LUT-based memory and abundant registers — with a 2.375 V–2.625 V supply window and a 0 °C to 85 °C operating range.

Key Features

  • Logic Capacity — Approximately 1,728 logic elements and around 57,906 system gates provide mid-range programmable logic resources for glue logic, protocol handling and custom datapaths.
  • Embedded Memory — 32,768 bits of on-chip RAM support block- and LUT-based memory structures for FIFOs, buffers and small on-chip storage.
  • I/O Density & Interfaces — 180 user I/O pins in a 256-BBGA (256-PBGA, 27 × 27 mm) package enable dense board-level connectivity for parallel buses, peripheral interfaces and system I/O.
  • Clocking & Timing — Built-in clock-management features (including multiple delay-locked loops and dedicated global clock nets as described in the Virtex family specification) support advanced clock control and low-skew distribution.
  • Configuration & Reprogrammability — SRAM-based in-system configuration allows unlimited re-programmability and multiple programming modes for field updates and development iterations.
  • Power & Supply — Operates from a core supply range of 2.375 V to 2.625 V, suitable for designs matching the Virtex 2.5 V family supply requirements.
  • Package & Mounting — Surface-mount 256-BBGA package (256-PBGA, 27 × 27 mm) supports compact board integration and high pin-count designs.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications; RoHS compliant.

Typical Applications

  • Communications & Networking — Implement protocol translation, interface bridging or custom packet-processing logic using the device’s I/O density and reprogrammable logic.
  • PCI and CompactPCI Systems — Suitable for designs that leverage the Virtex family’s support for PCI-compliant implementations and hot‑swappable CompactPCI architectures as described in the family specification.
  • Embedded Systems & Prototyping — Reprogrammability and on-chip memory make the device useful for iterative hardware development, algorithm prototyping and embedded controller functions.
  • Instrumentation & Test Equipment — Use the FPGA for data capture, pre‑processing and custom timing control where flexible logic and deterministic I/O are required.

Unique Advantages

  • Balanced Logic and Memory — The combination of approximately 1,728 logic elements and 32,768 bits of on-chip RAM supports mid-density designs without external memory for many control and buffering tasks.
  • High I/O Count in Compact Package — 180 user I/O pins in a 27 × 27 mm 256-BBGA deliver significant connectivity while conserving board area.
  • Reprogrammable SRAM Architecture — In-system configurability enables field updates and iterative development flows, reducing time-to-market for evolving designs.
  • Advanced Clock Management — Dedicated DLLs and hierarchical clock resources (as provided by the Virtex family) simplify multi-clock-domain designs and reduce clock skew concerns.
  • Commercial-Grade Reliability — Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployment.

Why Choose XCV50-4BG256C?

The XCV50-4BG256C positions itself as a practical Virtex-class FPGA for commercial designs that need reprogrammable logic, moderate gate density and substantial I/O capability in a compact BGA package. Its combination of logic elements, embedded RAM and clocking resources supports a range of mid-density applications from communications interfaces to embedded control and test equipment.

For developers and procurement teams seeking a field-updatable, RoHS-compliant FPGA with a clear supply voltage and temperature specification, the XCV50-4BG256C offers a dependable platform consistent with the Virtex family’s architecture and toolchain support.

Request a quote or submit an RFQ to receive pricing, availability and lead-time information for the XCV50-4BG256C. Our team can provide technical details and support to help evaluate integration into your design.

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