XCV50-4FG256I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 176 32768 1728 256-BGA |
|---|---|
| Quantity | 620 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 57906 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of XCV50-4FG256I – Virtex Field Programmable Gate Array, 1,728 logic elements, 32,768-bit RAM, 176 I/O, 256-BGA
The XCV50-4FG256I is an SRAM-based Virtex® FPGA IC delivering programmable logic, on-chip memory and flexible I/O in a 256-ball BGA package. With 1,728 logic elements and 32,768 bits of embedded RAM, this device targets designs that require reconfigurable, high-density logic and reliable operation across an industrial temperature range.
Its architecture and built-in system features support applications such as communications interfaces, Compact PCI systems and custom digital logic where in-system reprogrammability, multi-standard I/O and deterministic clocking are required.
Key Features
- Core architecture SRAM-based Virtex FPGA architecture providing reprogrammable logic and routing resources for custom digital designs.
- Logic capacity 1,728 logic elements and approximately 57,906 system gates to implement medium-density designs.
- Embedded memory 32,768 bits of on-chip RAM for data buffering, FIFOs and state storage.
- I/O and interfacing 176 available I/O pins and multi-standard SelectIO™ interface support for diverse signaling requirements.
- Clock management Built-in clock-management circuitry including multiple delay-locked loops (DLLs) and hierarchical global/ local clock routing for deterministic timing control.
- Configuration and programmability SRAM-based in-system configuration with unlimited reprogramming and four supported programming modes for flexible deployment.
- Performance and standards Device and family-level features include system performance up to 200 MHz and 66-MHz PCI compliance for relevant interface designs.
- Package and mounting 256-ball BGA (256-FBGA, 17 × 17 mm footprint) in a surface-mount form factor for compact board-level integration.
- Power and operating range Voltage supply range 2.375 V to 2.625 V; industrial operating temperature range of −40 °C to 100 °C.
- Quality and compliance 100% factory tested and RoHS compliant.
Typical Applications
- Communications equipment Implements protocol processing, interface bridging and PCI-compliant functions using multi-standard I/O and on-chip RAM.
- Compact PCI and hot-swappable systems Supports Compact PCI hot-swap designs and 66-MHz PCI-compliant interfaces for modular system architectures.
- Industrial control and automation Industrial-grade temperature rating and reprogrammability enable robust control logic, motor control interfaces and sensor aggregation.
- Prototyping and custom logic Reprogrammable FPGA fabric with embedded memory and clock management for proof-of-concept, emulation and custom ASIC replacement workflows.
Unique Advantages
- Flexible, reprogrammable platform: SRAM-based configuration with unlimited reprogramming lets you iterate and update logic in-system.
- Integrated memory and logic: Combines 1,728 logic elements with 32,768 bits of embedded RAM to minimize external components and simplify designs.
- Deterministic clocking: Multiple DLLs and hierarchical clock networks support precise timing control for synchronous systems.
- Broad I/O capability: 176 I/O pins and multi-standard SelectIO™ support diverse interface requirements without extensive external translation logic.
- Industrial robustness: Specified for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
- Compact board-level footprint: 256-FBGA (17 × 17 mm) package provides a space-efficient solution for dense PCBs.
Why Choose XCV50-4FG256I?
The XCV50-4FG256I delivers a balanced mix of reprogrammable logic, embedded RAM and flexible I/O in a compact industrial-grade package. Its combination of 1,728 logic elements, 32,768 bits of on-chip memory, deterministic clocking and multiple programming modes makes it well suited for communications, industrial control and prototyping applications that require field-updatable logic and reliable operation over a wide temperature range.
Designed for engineers who need a configurable, medium-density FPGA platform with industry-oriented specifications and proven Virtex family architecture, the XCV50-4FG256I provides a scalable and maintainable building block for embedded and system-level designs.
Request a quote or submit a pricing inquiry to evaluate XCV50-4FG256I for your next design and receive technical sales assistance and availability information.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








