XCV50-4FG256I

IC FPGA 176 I/O 256FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 176 32768 1728 256-BGA

Quantity 620 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells1728
Number of Gates57906ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XCV50-4FG256I – Virtex Field Programmable Gate Array, 1,728 logic elements, 32,768-bit RAM, 176 I/O, 256-BGA

The XCV50-4FG256I is an SRAM-based Virtex® FPGA IC delivering programmable logic, on-chip memory and flexible I/O in a 256-ball BGA package. With 1,728 logic elements and 32,768 bits of embedded RAM, this device targets designs that require reconfigurable, high-density logic and reliable operation across an industrial temperature range.

Its architecture and built-in system features support applications such as communications interfaces, Compact PCI systems and custom digital logic where in-system reprogrammability, multi-standard I/O and deterministic clocking are required.

Key Features

  • Core architecture  SRAM-based Virtex FPGA architecture providing reprogrammable logic and routing resources for custom digital designs.
  • Logic capacity  1,728 logic elements and approximately 57,906 system gates to implement medium-density designs.
  • Embedded memory  32,768 bits of on-chip RAM for data buffering, FIFOs and state storage.
  • I/O and interfacing  176 available I/O pins and multi-standard SelectIO™ interface support for diverse signaling requirements.
  • Clock management  Built-in clock-management circuitry including multiple delay-locked loops (DLLs) and hierarchical global/ local clock routing for deterministic timing control.
  • Configuration and programmability  SRAM-based in-system configuration with unlimited reprogramming and four supported programming modes for flexible deployment.
  • Performance and standards  Device and family-level features include system performance up to 200 MHz and 66-MHz PCI compliance for relevant interface designs.
  • Package and mounting  256-ball BGA (256-FBGA, 17 × 17 mm footprint) in a surface-mount form factor for compact board-level integration.
  • Power and operating range  Voltage supply range 2.375 V to 2.625 V; industrial operating temperature range of −40 °C to 100 °C.
  • Quality and compliance  100% factory tested and RoHS compliant.

Typical Applications

  • Communications equipment  Implements protocol processing, interface bridging and PCI-compliant functions using multi-standard I/O and on-chip RAM.
  • Compact PCI and hot-swappable systems  Supports Compact PCI hot-swap designs and 66-MHz PCI-compliant interfaces for modular system architectures.
  • Industrial control and automation  Industrial-grade temperature rating and reprogrammability enable robust control logic, motor control interfaces and sensor aggregation.
  • Prototyping and custom logic  Reprogrammable FPGA fabric with embedded memory and clock management for proof-of-concept, emulation and custom ASIC replacement workflows.

Unique Advantages

  • Flexible, reprogrammable platform: SRAM-based configuration with unlimited reprogramming lets you iterate and update logic in-system.
  • Integrated memory and logic: Combines 1,728 logic elements with 32,768 bits of embedded RAM to minimize external components and simplify designs.
  • Deterministic clocking: Multiple DLLs and hierarchical clock networks support precise timing control for synchronous systems.
  • Broad I/O capability: 176 I/O pins and multi-standard SelectIO™ support diverse interface requirements without extensive external translation logic.
  • Industrial robustness: Specified for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
  • Compact board-level footprint: 256-FBGA (17 × 17 mm) package provides a space-efficient solution for dense PCBs.

Why Choose XCV50-4FG256I?

The XCV50-4FG256I delivers a balanced mix of reprogrammable logic, embedded RAM and flexible I/O in a compact industrial-grade package. Its combination of 1,728 logic elements, 32,768 bits of on-chip memory, deterministic clocking and multiple programming modes makes it well suited for communications, industrial control and prototyping applications that require field-updatable logic and reliable operation over a wide temperature range.

Designed for engineers who need a configurable, medium-density FPGA platform with industry-oriented specifications and proven Virtex family architecture, the XCV50-4FG256I provides a scalable and maintainable building block for embedded and system-level designs.

Request a quote or submit a pricing inquiry to evaluate XCV50-4FG256I for your next design and receive technical sales assistance and availability information.

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