XCV50-4PQ240I

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 32768 1728 240-BFQFP

Quantity 1,231 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFPNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells1728
Number of Gates57906ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XCV50-4PQ240I – Virtex® Field Programmable Gate Array (FPGA) IC 166 32768 1728 240-BFQFP

The XCV50-4PQ240I is a Virtex-series SRAM-based FPGA offering 1,728 logic elements and approximately 57,906 system gates in a 240-BFQFP (32×32) surface-mount package. Designed for reprogrammable, high-density digital logic, it integrates on-chip memory, flexible I/O, and on-chip clock management to address a variety of embedded and industrial designs.

With 166 user I/Os, 32,768 bits of embedded RAM, an operating voltage range of 2.375 V to 2.625 V, and an industrial operating temperature range of −40 °C to 100 °C, the XCV50-4PQ240I is suitable for systems requiring reconfigurable logic, moderate on-chip memory, and robust environmental tolerance.

Key Features

  • Logic Capacity — 1,728 logic elements (as specified) supporting up to 57,906 system gates for implementing custom digital functions.
  • Embedded Memory — 32,768 bits of on-chip RAM for lookup tables, small data buffers, and embedded storage needs.
  • I/O Capability — 166 programmable I/O pins in a multi-standard SelectIO architecture (series-level feature), enabling connectivity to a variety of external devices and memory interfaces.
  • Clock Management — Built-in clock circuitry including multiple dedicated delay-locked loops (DLLs) and hierarchical global/local clock nets (series-level feature) for advanced clock control and low-skew distribution.
  • Configuration and Re-programmability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (series-level feature), enabling iterative development and field updates.
  • Package and Mounting — 240-BFQFP (32×32) surface-mount package for compact board-level integration.
  • Power and Temperature — Supply voltage 2.375 V to 2.625 V and industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Quality and Test — 100% factory tested (series-level statement) to support reliable production use.

Typical Applications

  • PCI and Compact PCI Interfaces — Implement PCI-compliant logic and Compact PCI hot-swap support using the device’s multi-standard I/O and series-level PCI compliance.
  • Industrial Control — Reconfigurable control logic, sensor interfacing, and protocol bridging in industrial systems, benefiting from the industrial temperature rating and surface-mount package.
  • Embedded Prototyping and Development — Field-programmable logic for iterative hardware development and system prototyping thanks to SRAM-based in-system configuration and unlimited re-programmability.
  • Custom I/O and Glue Logic — Replace fixed-function glue logic with a single programmable device to consolidate functions across multiple boards or subsystems.

Unique Advantages

  • Reprogrammable in-system design: SRAM-based architecture with multiple programming modes enables quick iteration and field updates without hardware replacement.
  • Balanced logic and memory: Combines 1,728 logic elements with 32,768 bits of embedded RAM to support both control logic and small data storage on-chip.
  • Flexible connectivity: 166 I/Os and series-level SelectIO support make interfacing to diverse external devices straightforward.
  • Robust environmental range: Industrial temperature rating (−40 °C to 100 °C) and surface-mount packaging suit demanding deployment conditions.
  • On-chip clock control: Dedicated DLLs and hierarchical clock distribution facilitate low-skew timing and advanced clocking schemes (series-level features).
  • Production readiness: Device is 100% factory tested, providing traceable quality for production use.

Why Choose XCV50-4PQ240I?

The XCV50-4PQ240I positions itself as a reprogrammable, mid-density FPGA solution for designers who need a compact package, flexible I/O, and embedded RAM for control, interface, and prototyping tasks. Its combination of 1,728 logic elements, 166 I/Os, and 32,768 bits of on-chip memory enables consolidation of custom digital logic while supporting iterative development through in-system reprogramming.

This device is well suited to teams developing industrial and embedded systems that require temperature tolerance, configurable interfaces, and the ability to update logic in the field. It benefits projects that value a proven FPGA architecture with factory testing and the configuration flexibility inherent to SRAM-based devices.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XCV50-4PQ240I.

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