XCV50-5BG256I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 180 32768 1728 256-BBGA |
|---|---|
| Quantity | 287 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 180 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 57906 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of XCV50-5BG256I – Virtex® Field Programmable Gate Array (FPGA) IC 180 I/O 32,768-bit RAM 1,728 Logic Elements 256-BBGA
The XCV50-5BG256I is an SRAM-based Virtex FPGA offering reprogrammable logic in a 256-ball BGA (27×27) surface-mount package. Designed for embedded and industrial applications, it provides a balance of logic capacity, on‑chip memory and flexible I/O for custom digital systems.
Key hardware attributes include approximately 57,906 system gates, 1,728 logic elements, 32,768 bits of embedded RAM and up to 180 I/O pins, with industrial operating range and a 2.375–2.625 V core supply.
Key Features
- Logic Capacity – 1,728 logic elements (16×24 CLB array) providing approximately 57,906 system gates for custom logic implementation.
- Embedded Memory – 32,768 bits of on‑chip Block RAM and SelectRAM+ support for configurable LUT-based and dual-ported RAM structures.
- I/O Flexibility – Up to 180 I/O pins with multi-standard SelectIO support (16 high-performance interface standards) to interface with a variety of external devices.
- Clock Management – Four dedicated delay-locked loops (DLLs), four primary low‑skew global clock nets and 24 secondary local clock nets for refined clock distribution and low skew.
- Arithmetic and DSP Support – Dedicated carry logic and multiplier support to accelerate arithmetic and wide-input functions.
- Performance – Architecture and process optimized for system performance (datasheet references up to 200 MHz system performance) and 66‑MHz PCI compliance.
- Configuration and Reprogrammability – SRAM-based in-system configuration with multiple programming modes and unlimited re-programmability.
- Package and Mounting – 256-ball BBGA (256‑PBGA, 27×27) surface-mount package suitable for compact board designs.
- Industrial Temperature Range – Rated for operation from −40°C to 100°C.
- Power – Core voltage supply specified at 2.375 V to 2.625 V.
- Compliance – RoHS compliant.
Typical Applications
- PCI and Compact PCI Systems – 66‑MHz PCI compliance and hot‑swappable support make the device suitable for PCI-based interface and controller functions.
- Embedded Control and Industrial Automation – Reprogrammable logic and industrial temperature rating support custom control algorithms, sensor interfacing and machine control tasks.
- Memory Interface and Data Buffering – On‑chip Block RAM and SelectRAM+ support for efficient buffering and fast interfaces to external high‑performance RAMs.
- Custom DSP and Arithmetic Engines – Dedicated carry chains and multiplier support enable implementation of arithmetic-intensive blocks and accelerators.
Unique Advantages
- Reprogrammable Platform: SRAM-based configuration with multiple programming modes enables iterative development and in-system updates.
- Integrated Clock Control: Four DLLs and an organized global/local clock network simplify low-skew clock distribution for timing-critical designs.
- Flexible I/O Standards: Support for 16 high-performance interface standards and 180 I/O pins enables broad connectivity without external translators.
- Compact, Surface-Mount Packaging: 256‑BBGA (27×27) package delivers high integration density for space-constrained PCBs.
- Industrial Reliability: Rated for −40°C to 100°C operation and 100% factory tested for deployment in industrial environments.
- Standards-Friendly: Documented 66‑MHz PCI compliance supports straightforward integration into legacy and existing PCI systems.
Why Choose XCV50-5BG256I?
The XCV50-5BG256I combines a practical balance of logic density, embedded memory and robust clocking features in a compact 256-BBGA package, making it well suited for industrial and embedded designs that require in-field reprogrammability and flexible I/O. Its documented operating range, RoHS compliance and factory testing provide traceable, production-ready hardware characteristics.
Choose this device for applications that need a reconfigurable hardware platform with moderate logic and memory resources, deterministic clock control and a compact surface-mount footprint to streamline board-level integration and reduce BOM complexity.
Request a quote or submit an inquiry to receive pricing and availability information for the XCV50-5BG256I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








