XCV50-5BG256I

IC FPGA 180 I/O 256BGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 180 32768 1728 256-BBGA

Quantity 287 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BBGANumber of I/O180Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells1728
Number of Gates57906ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XCV50-5BG256I – Virtex® Field Programmable Gate Array (FPGA) IC 180 I/O 32,768-bit RAM 1,728 Logic Elements 256-BBGA

The XCV50-5BG256I is an SRAM-based Virtex FPGA offering reprogrammable logic in a 256-ball BGA (27×27) surface-mount package. Designed for embedded and industrial applications, it provides a balance of logic capacity, on‑chip memory and flexible I/O for custom digital systems.

Key hardware attributes include approximately 57,906 system gates, 1,728 logic elements, 32,768 bits of embedded RAM and up to 180 I/O pins, with industrial operating range and a 2.375–2.625 V core supply.

Key Features

  • Logic Capacity – 1,728 logic elements (16×24 CLB array) providing approximately 57,906 system gates for custom logic implementation.
  • Embedded Memory – 32,768 bits of on‑chip Block RAM and SelectRAM+ support for configurable LUT-based and dual-ported RAM structures.
  • I/O Flexibility – Up to 180 I/O pins with multi-standard SelectIO support (16 high-performance interface standards) to interface with a variety of external devices.
  • Clock Management – Four dedicated delay-locked loops (DLLs), four primary low‑skew global clock nets and 24 secondary local clock nets for refined clock distribution and low skew.
  • Arithmetic and DSP Support – Dedicated carry logic and multiplier support to accelerate arithmetic and wide-input functions.
  • Performance – Architecture and process optimized for system performance (datasheet references up to 200 MHz system performance) and 66‑MHz PCI compliance.
  • Configuration and Reprogrammability – SRAM-based in-system configuration with multiple programming modes and unlimited re-programmability.
  • Package and Mounting – 256-ball BBGA (256‑PBGA, 27×27) surface-mount package suitable for compact board designs.
  • Industrial Temperature Range – Rated for operation from −40°C to 100°C.
  • Power – Core voltage supply specified at 2.375 V to 2.625 V.
  • Compliance – RoHS compliant.

Typical Applications

  • PCI and Compact PCI Systems – 66‑MHz PCI compliance and hot‑swappable support make the device suitable for PCI-based interface and controller functions.
  • Embedded Control and Industrial Automation – Reprogrammable logic and industrial temperature rating support custom control algorithms, sensor interfacing and machine control tasks.
  • Memory Interface and Data Buffering – On‑chip Block RAM and SelectRAM+ support for efficient buffering and fast interfaces to external high‑performance RAMs.
  • Custom DSP and Arithmetic Engines – Dedicated carry chains and multiplier support enable implementation of arithmetic-intensive blocks and accelerators.

Unique Advantages

  • Reprogrammable Platform: SRAM-based configuration with multiple programming modes enables iterative development and in-system updates.
  • Integrated Clock Control: Four DLLs and an organized global/local clock network simplify low-skew clock distribution for timing-critical designs.
  • Flexible I/O Standards: Support for 16 high-performance interface standards and 180 I/O pins enables broad connectivity without external translators.
  • Compact, Surface-Mount Packaging: 256‑BBGA (27×27) package delivers high integration density for space-constrained PCBs.
  • Industrial Reliability: Rated for −40°C to 100°C operation and 100% factory tested for deployment in industrial environments.
  • Standards-Friendly: Documented 66‑MHz PCI compliance supports straightforward integration into legacy and existing PCI systems.

Why Choose XCV50-5BG256I?

The XCV50-5BG256I combines a practical balance of logic density, embedded memory and robust clocking features in a compact 256-BBGA package, making it well suited for industrial and embedded designs that require in-field reprogrammability and flexible I/O. Its documented operating range, RoHS compliance and factory testing provide traceable, production-ready hardware characteristics.

Choose this device for applications that need a reconfigurable hardware platform with moderate logic and memory resources, deterministic clock control and a compact surface-mount footprint to streamline board-level integration and reduce BOM complexity.

Request a quote or submit an inquiry to receive pricing and availability information for the XCV50-5BG256I.

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