XCV400E-7BG560I

IC FPGA 404 I/O 560MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 404 163840 10800 560-LBGA Exposed Pad, Metal

Quantity 1,088 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells10800
Number of Gates569952ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits163840

Overview of XCV400E-7BG560I – Virtex‑E Field Programmable Gate Array (FPGA), 560‑LBGA

The XCV400E-7BG560I is a Virtex‑E family SRAM-based FPGA offered in a 560‑LBGA exposed pad package. It provides a balanced mix of logic, on-chip memory, and I/O density for system designs that require reprogrammable logic, high pin count, and extended temperature operation.

With 10,800 logic elements across 2,400 configurable logic blocks (CLBs), approximately 0.16 Mbits of embedded memory, and 404 general-purpose I/O pins, this device targets applications that need flexible, high-density programmable logic operating from a 1.71 V to 1.89 V core supply and across an industrial temperature range.

Key Features

  • Core Logic  2,400 configurable logic blocks (CLBs) providing a total of 10,800 logic elements for implementing custom digital functions.
  • On‑chip Memory  Approximately 0.16 Mbits of embedded RAM available for distributed and block memory requirements.
  • I/O Density & Flexibility  404 I/O pins to support wide bus interfaces, external memory connections, and high pin‑count peripherals.
  • Performance Characteristics  Device family features include high internal performance and multi‑level LUT structures as documented for Virtex‑E devices.
  • Packaging  560‑LBGA exposed pad, metal package (supplier device package: 560‑MBGA, 42.5 × 42.5 mm) suitable for surface‑mount assembly.
  • Power  Core supply range specified at 1.71 V to 1.89 V for the internal logic and memory.
  • Industrial Temperature Range  Specified operating temperature from −40 °C to 100 °C for industrial applications.
  • Manufacturing & Compliance  RoHS‑compliant and 100% factory tested as part of the Virtex‑E product family production specifications.
  • System Integration  SRAM‑based, in‑system reprogrammability inherent to the Virtex‑E family enables iterative development and field updates.

Typical Applications

  • High‑speed interface bridging  Implement protocol conversion, bus bridging or glue logic using the device’s high I/O count and reprogrammable logic.
  • Memory interface and controller prototyping  Use the on‑chip RAM and abundant I/O to develop and validate interfaces to external memory subsystems.
  • Data acquisition and signal preprocessing  Deploy configurable logic and embedded memory for front‑end processing, buffering, and formatting of sensor or data streams.
  • Industrial control and automation  Leverage the industrial temperature rating and flexible I/O to implement custom control logic and factory automation functions.

Unique Advantages

  • Balanced logic and memory  10,800 logic elements paired with approximately 0.16 Mbits of embedded RAM provide both compute density and local buffering without external resources.
  • High I/O count  404 I/O pins simplify direct interfacing to wide parallel buses, sensors, and high‑pin peripherals, reducing external glue logic.
  • Industrial robustness  Specified operation from −40 °C to 100 °C supports deployment in temperature‑challenging environments.
  • Compact, manufacturable package  560‑LBGA exposed pad (42.5 × 42.5 mm) offers a high‑pin, surface‑mount form factor for compact system boards.
  • Field reprogrammability  SRAM‑based architecture enables in‑system updates and iterative design refinement without hardware replacement.
  • Standards and ecosystem  As a member of the Virtex‑E family, the device benefits from documented family features and development support referenced in product specifications.

Why Choose XCV400E-7BG560I?

The XCV400E-7BG560I delivers a practical combination of logic density, embedded memory, and I/O capacity in a single, surface‑mount LBGA package suited for industrial temperature environments. It is appropriate for engineers designing reprogrammable systems that require substantial I/O, on‑chip RAM for buffering or small lookup tables, and the ability to update logic in the field.

Designed within the Virtex‑E family framework, this device offers predictable electrical and thermal characteristics, making it suitable for development, prototyping, and deployed systems that rely on scalability and ongoing firmware revisions.

Request a quote or submit an RFQ to get pricing and availability for the XCV400E-7BG560I. Our team can provide lead‑time information and support for procurement and integration.

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