XCV400E-7BG560C

IC FPGA 404 I/O 560MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 404 163840 10800 560-LBGA Exposed Pad, Metal

Quantity 1,560 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells10800
Number of Gates569952ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits163840

Overview of XCV400E-7BG560C – Virtex®-E FPGA, 10800 Logic Elements, 560-LBGA

The XCV400E-7BG560C is a Virtex®-E field programmable gate array (FPGA) offered in a 560-pin LBGA package with exposed pad. It implements 10,800 logic elements and provides approximately 0.16 Mbits of embedded memory, making it suitable for compact, reprogrammable digital designs.

Built on the Virtex-E family architecture, this 1.8 V FPGA targets high-performance digital systems that require dense logic, significant I/O capacity, and flexible clock and memory interfacing while operating within commercial temperature and voltage ranges.

Key Features

  • Core Logic — 10,800 logic elements and 569,952 equivalent gates provide substantial programmable logic capacity for custom digital functions.
  • Embedded Memory — 163,840 bits of on-chip RAM (approximately 0.16 Mbits) for distributed and block memory needs within designs.
  • I/O Density — 404 total I/O pins to support wide parallel interfaces and multiple external peripherals.
  • Voltage Supply — Core supply range 1.71 V to 1.89 V, aligned with the Virtex-E 1.8 V internal supply architecture.
  • Clock and Timing — Family-level clock-management features include multiple digital DLLs (documented in the Virtex-E series) for clock multiplication/division and DDR-friendly duty-cycle control.
  • Memory & External Interface Support — Series documentation highlights support for high-performance memory interfaces and synchronous block RAM options suitable for system memory controllers.
  • Packaging — 560-LBGA exposed pad, metal package; supplier device package listed as 560-MBGA (42.5 × 42.5 mm) in a surface-mount form factor.
  • Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards & Reconfigurability — SRAM-based in-system configurability enables unlimited reprogramming for iterative design and field updates; the Virtex-E family includes PCI-compliant options and broad interface support as documented for the series.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • High-performance digital systems — Use the FPGA’s logic capacity and on-chip memory for custom processing, data path acceleration, and control logic in compact systems.
  • Memory interface and bridging — Leverage the device’s memory resources and series-level support for high-speed memory interfaces to implement controllers and interface bridges.
  • High-density I/O applications — With 404 I/Os, the device is well suited to designs requiring wide parallel buses, multi-channel I/O, or extensive peripheral interfacing.
  • Prototyping and in-system reconfiguration — SRAM-based configuration enables iterative development and field updates without hardware changes.

Unique Advantages

  • Substantial programmable capacity: 10,800 logic elements and nearly 570k equivalent gates allow complex logic and state machine implementations without external logic.
  • On-chip RAM for local buffering: Approximately 0.16 Mbits of embedded memory reduces dependence on external RAM for intermediate storage and buffering.
  • High I/O count: 404 I/Os enable direct connection to multiple peripherals and parallel interfaces, simplifying board-level routing and reducing external components.
  • Flexible clock management (series-level): Built-in DLL-based clock functions documented for the Virtex-E family aid in generating and conditioning timing for DDR and high-speed interfaces.
  • Commercial-grade reliability: Specified for 0 °C to 85 °C operation and supplied in a robust 560-LBGA package suitable for surface-mount assembly.
  • RoHS compliant: Meets environmental compliance requirements for lead-free assembly flows.

Why Choose XCV400E-7BG560C?

The XCV400E-7BG560C combines a mid-range Virtex-E logic density with substantial I/O and embedded memory in a compact 560-LBGA package. Its 1.8 V core supply, SRAM-based reprogrammability, and series-level support for high-performance interfaces make it a practical choice for designers who need reconfigurable, memory-rich logic in commercial-temperature applications.

This device is well suited to engineers building systems that require flexible on-chip resources, dense I/O, and the ability to iterate designs through in-system configuration, delivering long-term adaptability within a proven Virtex-E architecture.

Request a quote or submit an inquiry to receive pricing, availability, and technical purchasing information for the XCV400E-7BG560C.

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