XCV400E-7BG432C0773

FPGA, 2400 CLBS, 468252 GATES, 2
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 316 163840 10800 432-LBGA Exposed Pad

Quantity 1,616 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case432-LBGA Exposed PadNumber of I/O316Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells10800
Number of Gates569952ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits163840

Overview of XCV400E-7BG432C0773 – Virtex®-E FPGA, 432-LBGA Exposed Pad

The XCV400E-7BG432C0773 is a Virtex®-E field programmable gate array (FPGA) IC from AMD, supplied in a 432-LBGA exposed pad package. As a commercial-grade FPGA, it provides a balance of logic capacity, on-chip memory and I/O density suitable for midsize embedded logic designs and development platforms.

With 10,800 logic elements, approximately 0.16 Mbits of embedded memory and 316 user I/Os, this device targets designs that require moderate logic integration and flexible interfacing in a compact surface-mount footprint.

Key Features

  • Logic Capacity  Includes 10,800 logic elements and 569,952 gates to implement medium-complexity custom logic and state machines.
  • Embedded Memory  Provides 163,840 total RAM bits — approximately 0.16 Mbits of embedded memory for buffering, small FIFOs and local data storage.
  • I/O Density  316 user I/Os enable dense external interfacing for parallel buses, peripherals and multiple I/O domains.
  • Power and Supply  Designed for operation from a 1.71 V to 1.89 V supply range to match target system power rails.
  • Package and Mounting  432-LBGA exposed pad package (supplier device package: 432-MBGA 40×40) in a surface-mount form factor for space-efficient board integration.
  • Operating Conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS-compliant to support a lead-free manufacturing flow.

Typical Applications

  • Prototyping and Development  Use as a mid-density FPGA for logic validation, hardware prototyping and iterative design testing where reprogrammability is required.
  • Consumer Electronics  Implement custom control logic and peripheral glue in consumer devices, leveraging the device's commercial-grade rating and compact LBGA package.
  • Communications and Interfaces  Deploy for protocol bridging, parallel/serial interfacing or custom I/O aggregation using the 316 available I/O pins.
  • Test and Measurement  Integrate into instrumentation for custom timing, data collection and preprocessing with on-chip RAM for short-term buffering.

Unique Advantages

  • Balanced Logic and Memory  10,800 logic elements combined with approximately 0.16 Mbits of embedded memory support a wide range of mid-complexity designs without external SRAM for small buffers.
  • High I/O Count  316 I/Os provide flexibility to connect multiple peripherals and interfaces directly to the FPGA, reducing the need for additional I/O expanders.
  • Compact Surface-Mount Packaging  The 432-LBGA exposed pad (432-MBGA 40×40) delivers a compact footprint for space-constrained PCBs while supporting thermal dissipation via the exposed pad.
  • Commercial-Grade Reliability  Rated for 0 °C to 85 °C operation, making it suitable for standard commercial environments and manufacturing requirements.
  • Lead-Free Compliance  RoHS compliance supports modern lead-free assembly processes and regulatory needs.
  • Low-Voltage Operation  Support for 1.71 V to 1.89 V supply simplifies integration with contemporary low-voltage systems.

Why Choose XCV400E-7BG432C0773?

The XCV400E-7BG432C0773 offers a practical combination of logic density, embedded memory and I/O capacity in a commercial-grade Virtex®-E FPGA from AMD. Its 10,800 logic elements, 316 I/Os and compact 432-LBGA exposed pad package make it well suited for designers looking to implement medium-complexity custom logic and interfacing in space-conscious, surface-mount applications.

Selected for projects where reprogrammability, moderate on-chip memory and a high I/O count are required, this device delivers deterministic on-board resources while meeting RoHS environmental standards and common commercial operating conditions.

Request a quote or submit a pricing request for the XCV400E-7BG432C0773 to evaluate its fit in your next FPGA-based design.

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