XCV400E-6BG432C

The XCV400E-6BG432C is a Virtex®-E field programmable gate array (FPGA) IC from AMD, offered in a 432-pin LBGA exposed-pad metal package for surface-mount applications. It delivers a high-density, reprogrammable logic fabric with substantial I/O and on-chip memory for demanding digital designs in commercial-temperature environments.

Designed for high-performance interfaces and flexible I/O standards, this 1.8 V-class device targets applications that require dense logic, fast clocking and robust on-chip memory and clock-management resources while maintaining RoHS compliance.

Key Features

• Core Logic — Approximately 10,800 logic elements and 2400 configurable logic blocks (CLBs) supporting 569,952 system gates for complex logic integration and custom datapaths.
• Embedded Memory — Approximately 0.16 Mbits (163,840 bits) of on-chip RAM enabling local data storage and buffering for high-bandwidth designs.
• I/O and Interfaces — Up to 316 I/O pins supporting a wide range of interface standards (family-level SelectI/O+™ technology) and PCI-compliant 3.3 V, 32/64-bit, 33/66-MHz operation as specified for the Virtex‑E series.
• Differential Signalling Support — Series-level support for LVDS, BLVDS and LVPECL for high-speed differential interface options and clock inputs suitable for multi-hundred MHz operation.
• Clock Management — Family-level architecture includes eight fully digital delay-locked loops (DLLs) for clock multiply/divide, DDR duty-cycle synthesis and zero-delay conversion of high-speed inputs.
• Memory and Throughput — SelectRAM+™ memory hierarchy (series feature) with true dual-port block RAM capability and design support for high-bandwidth external memory interfaces.
• Power and Supply — Internal VCCINT supply range 1.71 V to 1.89 V (1.8 V class); I/O buffers support multiple I/O voltages per family specification.
• Package & Mounting — 432-LBGA exposed pad, metal package (supplier device package: 432‑MBGA 40×40) for surface-mount PCB assembly.
• Temperature & Grade — Commercial grade with an operating temperature range from 0 °C to 85 °C; RoHS compliant.
• SRAM-Based In-System Configuration — SRAM-based architecture enables unlimited re-programmability for iterative development and field updates.

Typical Applications

• High-speed bus bridging and protocol adaptation — Use the device’s PCI-compliant family-level support and abundant I/O to implement 32/64-bit PCI interfaces and custom bus bridges.
• Memory interface and controller development — Leverage the SelectRAM+™ memory hierarchy and block RAM capabilities to prototype and implement high-performance external memory interfaces.
• Multi-standard serial/differential I/O — Implement LVDS, BLVDS or LVPECL-based signaling for high-speed data lanes and clock distribution using the device’s differential signaling support.
• Custom compute and DSP functions — Deploy dense logic resources and on-chip RAM to accelerate bespoke arithmetic, signal processing and data-path designs.

Unique Advantages

• High-density programmable logic: 10,800 logic elements and a ~570k-gate equivalent enable substantial integration of complex functions on a single device.
• Flexible, high-performance I/O: Up to 316 I/O pins and family-level SelectI/O+™ support allow multiple interface standards and high aggregate bandwidth for system-level connectivity.
• Robust on-chip memory and throughput: Approximately 0.16 Mbits of embedded RAM and SelectRAM+™ architecture support demanding buffering and memory-intensive tasks.
• Advanced clock management: Eight digital DLLs at the family level provide clock multiplication/division and DDR-friendly clocking for precise timing control.
• Reprogrammable and field-updatable: SRAM-based in-system configuration enables iterative development, design updates, and long-term flexibility.
• Commercial-grade, RoHS compliant: Designed for 0 °C to 85 °C operation and compliant with RoHS requirements for modern electronics supply chains.

Why Choose XCV400E-6BG432C?

The XCV400E-6BG432C positions itself as a versatile Virtex‑E series FPGA that combines high logic density, significant I/O capacity and embedded memory with advanced clock management features. Its 1.8 V-class internal supply, series-level support for multiple high-speed I/O standards, and SRAM-based reprogrammability make it suitable for commercial designs that require flexible, high-throughput programmable logic.

This device is well suited to engineers and teams needing a scalable programmable platform for protocol bridging, memory interface development, custom DSP/compute blocks and other high-performance digital designs where reprogrammability and integration reduce BOM complexity and accelerate development cycles.

Request a quote or submit an inquiry for pricing, availability and lead time information to evaluate the XCV400E-6BG432C for your next design.