XCV400-5BG560I

The XCV400-5BG560I is a Virtex® Field Programmable Gate Array (FPGA) offering a balanced combination of logic capacity, on-chip memory, and I/O density for industrial applications. This SRAM-based, in-system configurable device delivers 10,800 logic elements, approximately 81.9 kbits of embedded RAM, and 404 user I/O to support medium-complexity digital designs.

Designed for industrial use, the device operates across a wide temperature range and uses a narrow core supply window, providing predictable integration for systems that require reprogrammability, clock management, and dense I/O in a compact 560-LBGA package.

Key Features

• Core Logic 10,800 logic elements and 468,252 gates provide the programmable fabric for custom digital functions and algorithm implementation.
• Embedded Memory Approximately 81,920 bits of on-chip RAM enable local buffering, lookup tables, and small data stores for timing-critical logic.
• I/O Density 404 user I/O pins support complex interfacing requirements and allow multiple simultaneous external connections from a single device.
• Clock and Timing Built-in clock-management features include multiple delay-locked loops (DLLs) and dedicated global/local clock networks to support advanced clock control and distribution.
• Configurable Architecture SRAM-based, in-system configuration permits unlimited reprogramming and multiple programming modes for iterative development and field updates.
• Performance Architecture and process choices support system-level performance suitable for applications requiring higher clock rates and throughput.
• Package & Power 560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) in a surface-mount form factor. Core supply voltage specified at 2.375 V to 2.625 V.
• Industrial Reliability Industrial-grade operating temperature range from −40 °C to 100 °C and 100% factory testing support deployment in demanding environments.
• System Support Features such as IEEE 1149.1 boundary-scan, die-temperature sensing, dedicated arithmetic support (carry logic and multipliers), and hierarchical routing enhance system integration and testability.

Typical Applications

• PCI and CompactPCI Systems Supports PCI-compliant interfaces and hot-swappable CompactPCI configurations where reprogrammable logic and dense I/O are required.
• Industrial Control and Automation Industrial-grade temperature range and robust packaging make the device suitable for motor control, machine vision pre-processing, and fieldbus interfacing in factory environments.
• Protocol Bridging and Interface Concentration High I/O count and flexible I/O standards enable protocol conversion, interface aggregation, and custom bus bridging tasks.
• Prototyping and In-System Reconfiguration SRAM-based, unlimited reprogramming modes support iterative development, algorithm updates, and in-field feature upgrades.

Unique Advantages

• Reprogrammable SRAM Architecture: Allows unlimited in-system updates to accelerate development cycles and enable field feature enhancements.
• High I/O Count: 404 user I/O pins reduce external multiplexing and simplify PCB routing for multi-channel designs.
• Compact, Thermally-Considered Package: 560-LBGA exposed-pad metal package provides a compact footprint with thermal conduction suitable for board-level integration.
• Integrated Clock Management: Multiple DLLs and hierarchical clock resources enable fine-grained timing control for high-performance synchronous designs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the environmental needs of industrial applications.
• Proven System Features: Boundary-scan, die-temperature sensing, dedicated arithmetic support, and factory testing simplify system bring-up and verification.

Why Choose XCV400-5BG560I?

The XCV400-5BG560I positions itself as a versatile, industrial-grade FPGA for designers who need a reliable, reprogrammable platform with substantial logic capacity, significant I/O density, and on-chip memory. Its combination of configurable logic, embedded RAM, clock management, and system-level features supports a wide range of embedded and infrastructure-focused designs.

Ideal for engineering teams implementing medium-complexity digital systems, custom interface logic, or field-updatable functionality, this device offers the predictability of a narrow core voltage range, rugged operating temperatures, and a compact LBGA package for dense board-level designs.

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