XCV400-5BG560C

The XCV400-5BG560C is a Virtex® SRAM-based FPGA offering high-density programmable logic in a 560-LBGA exposed-pad package. It provides 10,800 logic elements, approximately 81,920 bits of embedded memory, and 404 user I/O, making it suitable for high-performance digital designs and configurable system logic.

Built on the Virtex family architecture, this commercial-grade device targets applications that require flexible I/O, hierarchical on-chip memory, and reprogrammable system configuration while operating within a 2.375 V to 2.625 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

• Logic Capacity — 10,800 logic elements and 468,252 system gates support complex combinational and sequential designs.
• On-Chip Memory — Approximately 81,920 bits of embedded RAM with hierarchical memory options including LUT-configurable RAM and configurable 4k-bit dual-ported RAMs.
• High-Density I/O — 404 available I/O pins with multi-standard SelectIO™ support and 16 high-performance interface standards for diverse board-level connectivity.
• Clocking and Timing — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock management.
• Arithmetic and DSP Support — Dedicated carry logic, multiplier support, and cascade chains for wide-input functions accelerate arithmetic and signal-processing implementations.
• Configuration Flexibility — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes for iterative development and field updates.
• Package and Mounting — 560-LBGA exposed pad, metal (supplier package: 560-MBGA, 42.5 × 42.5 mm); surface-mount mounting for compact board integration.
• Power and Environmental — Operating supply voltage 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.
• System and Test Features — IEEE 1149.1 boundary-scan support, die-temperature sensor diode, and 100% factory testing.

Typical Applications

• PCI and CompactPCI Systems — 66‑MHz PCI compliance and hot‑swappable support enable use in modular I/O and communication backplanes.
• High-Performance Signal Processing — Dedicated multipliers, carry chains and abundant registers suit DSP algorithms and custom accelerators.
• Protocol Bridging and I/O Aggregation — Multi-standard SelectIO and 404 I/O support implement protocol conversion, interface bridging and custom peripheral controllers.
• Embedded System Prototyping — SRAM-based, reprogrammable configuration supports iterative development, in-system updates and proof-of-concept designs.

Unique Advantages

• Significant Logic Density: 10,800 logic elements and 468,252 gates provide ample capacity for medium-to-large FPGA designs without external logic.
• Rich On-Chip Memory: Approximately 81,920 bits of embedded RAM and LUT-configurable memory reduce dependence on external RAM for many buffering and local storage tasks.
• Flexible Clocking: Multiple DLLs and hierarchical clock nets enable refined clock control for timing-critical designs.
• Versatile I/O Options: 404 I/O with SelectIO multi-standard support simplifies interfacing to a wide range of peripherals and standards.
• In-System Reprogrammability: SRAM configuration with multiple programming modes supports iterative design flows and field updates.
• Commercial Temperature and Compliance: Designed for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose XCV400-5BG560C?

The XCV400-5BG560C combines a proven Virtex architecture with substantial logic, memory and I/O resources to address demanding digital, communication and control applications. Its clocking resources, arithmetic support and flexible on-chip memory enable efficient implementation of complex algorithms while retaining the advantages of SRAM-based reprogrammability.

Engineers and integrators seeking a commercial-grade, mid-to-high density FPGA with strong development support and configurable system features can leverage this device for rapid prototyping, in-field updates and compact board-level integration thanks to its 560-LBGA surface-mount package.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the XCV400-5BG560C.