F59D4G81XB-IP(2X)

4Gb NAND Flash Ind.
Part Description

Automotive grade -40~85°/ -40~105°C, SLC NAND Flash, 1.8V

Quantity 1,085 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48 pin TSOPI/ 63 Ball BGA/ 67 Ball BGAMemory FormatNAND FlashTechnologySLC NAND Flash
Memory Size4 GbitAccess Time25 nsGradeIndustrial
Clock FrequencyN/AVoltage2.5VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page200 µsPackaging48 pin TSOPI/ 63 Ball BGA/ 67 Ball BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization512M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D4G81XB-IP(2X) – Automotive grade -40~85°/ -40~105°C, SLC NAND Flash, 1.8V

The ESMT F59D4G81XB (2X) is a 1.8V single-level cell (SLC) NAND flash memory device organized as 512M × 8 and offering 4.295 Gbit of non-volatile storage. Designed as an industrial-grade NAND solution, it provides ONFI 1.0-compliant asynchronous parallel interface and a low-voltage 1.8 V supply for embedded storage and firmware applications.

With SLC technology, internal ECC options, and up to 100,000 program/erase cycles, the device targets applications that require durable, long-retention non-volatile memory in temperature ranges down to −40 °C.

Key Features

  • Memory Technology Single-level cell (SLC) NAND flash organized as 512M × 8 delivering 4.295 Gbit of non-volatile storage.
  • Voltage and Interface 1.8 V supply range (1.7 V–1.95 V documented in the datasheet) with a parallel asynchronous I/O interface and ONFI 1.0 compliance for command/address/data operations.
  • Performance and Timing Asynchronous I/O performance with specified access times; typical program/page and read/page timings include program page ~200 μs (typ) and read page down to 30–170 μs depending on ECC configuration.
  • Memory Organization & Capacity Page size of 4,352 bytes (4,096 + 256 spare), block size of 64 pages, single plane organization and device size of 4 Gbit (512M × 8).
  • Reliability & Endurance Endurance rated to 100,000 program/erase cycles with uncycled data retention documented for 10 years at 85 °C and JESD47G-compliant data retention practices.
  • Data Integrity & Management 8-bit internal ECC available (disabled by default, toggled via SET FEATURE), permanent block locking, block lock/OTP mode and internal data-move support within a plane.
  • Command & Feature Set ONFI NAND protocol with advanced commands including program/read page cache modes, read unique ID, programmable drive strength, and operation status reporting (status byte, R/B#).
  • Package & Mounting Multiple surface-mount packages available: 48‑pin TSOPI, 63‑ball BGA and 67‑ball BGA options for flexible board-level integration.
  • Operating Temperature Specified operating range down to −40 °C up to 85 °C.
  • Qualification & Compliance JEDEC qualification and RoHS compliance indicated in product data.

Typical Applications

  • Embedded Storage Non-volatile storage for firmware, boot code and system images where SLC endurance and retention are required.
  • Industrial Controllers Durable code and data storage for machine control, PLCs and industrial automation operating across −40 °C to 85 °C.
  • Data Logging High-reliability event and sensor data recording in instrumentation and monitoring systems.
  • Firmware and Boot Media Persistent storage for boot loaders, secure firmware blocks and device configuration with OTP and block-lock capabilities.

Unique Advantages

  • SLC Endurance: 100,000 program/erase cycles provide extended device lifetime for frequent-write applications.
  • Long Data Retention: Uncycled data retention specified at 10 years at 85 °C supports long-term storage requirements.
  • ONFI Compliance: Standard ONFI 1.0 command and interface support simplifies integration with existing NAND controllers.
  • Flexible Packaging: Available in TSOPI and multiple BGA packages to match PCB space and thermal requirements.
  • Built-in Data Management: Internal ECC control, block locking and OTP modes allow firmware-level control of data integrity and protection.
  • Low-Voltage Operation: 1.8 V supply operation reduces system power domain complexity for low-voltage designs.

Why Choose F59D4G81XB-IP(2X)?

The F59D4G81XB (2X) balances SLC endurance, long-term data retention and ONFI-compliant parallel interface in a compact, surface-mount package set. Its combination of program/erase endurance, internal ECC options and advanced command set makes it well suited to industrial embedded designs that require reliable non-volatile storage across a wide temperature range.

Choose this device when your design demands durable, low-voltage NAND storage with multiple package options and JEDEC-level qualification for streamlined integration and long-term field reliability.

Request a quote or submit an inquiry to receive pricing, lead-time and ordering information for the F59D4G81XB-IP(2X).

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