IMC1B1A3C3A9A5E3A3A0000

The IMC1B1A3C3A9A5E3A3A0000 is an Embedded Multimedia Card (eMMC) device providing non-volatile NAND flash storage in a compact 153-ball VFBGA package (11.5×13 mm). It implements flash NAND (SLC) memory organized as 4G × 8 for a total memory size of 32 Gbit (4 GB) and supports the eMMC 5.1 interface and HS400/HS200 bus modes as documented.

This device is intended for designs that require integrated, board-mounted persistent storage with documented eMMC device features such as boot operation mode, field firmware update, and write cache functionality. The specified operating temperature range is −25°C to 85°C, enabling deployment in applications that require extended ambient temperature support.

Key Features

• Memory Type: Non-volatile FLASH NAND (SLC) — provides single-level cell NAND flash organized as 4G × 8 for 32 Gbit (4 GB) capacity.
• Interface and Bus Modes: eMMC 5.1 interface — supports HS200 and HS400 bus speed modes as described in the product documentation.
• Package: 153-ball VFBGA (153-FBGA, 11.5×13 mm) — compact BGA footprint with documented ball assignment and package dimensions.
• Operating Temperature: −25°C to 85°C (TA) — supports designs requiring operation across this ambient range.
• Device Functionality: Boot operation mode and write cache support — includes features for booting and cached writes as described in the datasheet.
• Field Firmware Update (FFU): Supports field firmware update mechanisms documented in the datasheet for in-system firmware management.

Typical Applications

• Embedded Storage: Provides board-mounted persistent storage for embedded systems that use an eMMC 5.1 host interface.
• Boot and System Code Storage: Suitable for storing boot loaders and system firmware using the device's boot operation mode.
• Temperature-Extended Devices: Applicable to systems requiring operation between −25°C and 85°C where compact, surface-mounted storage is required.

Unique Advantages

• eMMC 5.1 Compliance: Standardized eMMC 5.1 interface and HS400/HS200 modes simplify host integration for supported controllers.
• SLC NAND Architecture: Uses FLASH NAND (SLC) memory organization (4G × 8, 32 Gbit) to provide the specified storage density and memory organization.
• Compact VFBGA Package: 153-ball VFBGA (11.5×13 mm) offers a space-efficient, board-mounted form factor with documented package and ball pattern details.
• Boot and Update Support: Built-in boot operation mode and field firmware update capabilities enable system boot integration and in-field firmware maintenance.
• Documented System Integration: Datasheet includes detailed eMMC device and bus descriptions (power-up, timing, registers, signal levels) to aid hardware and firmware integration.

Why Choose EMMC, 11.5X13 153 BALL, 4GB, -25?

This eMMC device combines a standardized eMMC 5.1 interface with SLC NAND flash in a compact 153-ball VFBGA package, delivering 32 Gbit (4 GB) of board-mounted non-volatile storage with documented boot, update, and cache features. The supplied datasheet details bus timing, power-up procedures, register maps, and package dimensions to support system integration and firmware development.

The IMC1B1A3C3A9A5E3A3A0000 is suited for designs that require an integrated eMMC solution with HS400/HS200 support and extended ambient operation from −25°C to 85°C, providing a clear specification set for embedded storage and firmware-managed applications.

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