IMC1B1A4C3A9A5I3A4A0000

The IMC1B1A4C3A9A5I3A4A0000 is an embedded multimedia card (eMMC) device providing 64 Gbit (8GB) of SLC NAND non‑volatile flash memory in a 153-ball VFBGA package (11.5 × 13 mm). It implements the eMMC 5.1 interface with HS400 support as documented in the product datasheet.

This device targets embedded storage applications that require a compact 153‑ball BGA footprint, an organized 8G × 8 memory layout, and extended ambient operation from -40 °C to 85 °C.

Key Features

• Memory Technology  SLC NAND non‑volatile flash memory providing 64 Gbit total capacity, organized as 8G × 8.
• Interface and Performance Modes  Compliant with eMMC_5.1 and supporting HS400 bus speed mode as described in the datasheet.
• Package  153‑ball VFBGA (153‑FBGA) with 11.5 × 13 mm footprint for space‑constrained embedded designs.
• Temperature Range  Rated for operation from -40 °C to 85 °C (TA), suitable for applications requiring extended ambient temperature support.
• Embedded Functions  Supports eMMC features noted in the datasheet including boot operation mode, field firmware update (FFU), and write cache behavior.
• Device Configuration  Memory format listed as FLASH with standard eMMC device signaling and registers (CID, CSD, EXT_CSD, OCR) documented in the datasheet.

Typical Applications

• Embedded Storage  Local non‑volatile storage for embedded systems that require an eMMC_5.1 interface and compact BGA mounting.
• Boot and System Firmware  Use as boot media for devices leveraging the eMMC boot operation mode described in the product documentation.
• Industrial Electronics  Storage for system data and firmware in equipment that operates across a wide ambient temperature range (-40 °C to 85 °C).

Unique Advantages

• Integrated eMMC 5.1 Interface: Simplifies system integration by providing a standard eMMC_5.1 HS400 interface as documented in the datasheet.
• SLC NAND Reliability: Uses SLC NAND flash technology for the underlying non‑volatile storage, consistent with the memory technology specification.
• Compact BGA Footprint: 153‑ball VFBGA (11.5 × 13 mm) package minimizes PCB area for space‑constrained designs.
• Extended Temperature Operation: Rated operation from -40 °C to 85 °C supports deployments in environments with wide ambient temperature variation.
• On‑device Features: Datasheet‑documented support for boot operation, field firmware update, and write cache provides system design flexibility.

Why Choose EMMC, 11.5X13 153 BALL, 8GB, -40?

This eMMC device from Intelligent Memory Ltd. combines 64 Gbit SLC NAND flash with an eMMC_5.1 HS400 interface in a compact 153‑ball VFBGA package, delivering a straightforward embedded storage option where board space, standard interface compatibility, and extended temperature range matter. The device documentation details bus timing, register maps (CID, CSD, EXT_CSD), and operational modes to support system integration.

Choose this part when you need a documented eMMC 5.1 solution with SLC flash technology, explicit support for boot and firmware update modes, and operation across -40 °C to 85 °C for long‑term, robust embedded storage implementations.

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