IMC1B1A8C1A0A1I3A8A0000

EMMC,5.1,153 BALL,64GB,-40C TO 8
Part Description

EMMC,5.1,153 BALL,64GB,-40C TO 8

Quantity 1,632 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntelligent Memory Ltd.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Affected
QualificationN/AECCNEAR99HTS Code8523.51.0000

Overview of IMC1B1A8C1A0A1I3A8A0000 – EMMC,5.1,153 BALL,64GB,-40C TO 8

The IMC1B1A8C1A0A1I3A8A0000 is an embedded non-volatile memory device implementing eMMC 5.1 with SLC NAND flash technology. It provides 512 Gbit (64G x 8) of FLASH memory in a compact 153-ball VFBGA package.

Designed for applications that require on-board eMMC 5.1 storage and extended temperature operation, this device combines high-density storage and a small footprint to simplify board-level integration.

Key Features

  • Memory Type & Technology Non-volatile FLASH using NAND (SLC) technology as specified in the product data.
  • Capacity & Organization 512 Gbit total capacity with a 64G × 8 memory organization (64GB).
  • Interface eMMC 5.1 memory interface for embedded storage integration.
  • Package 153-ball VFBGA (supplier device package listed as 153-FBGA, 11.5 × 13 mm) for compact mounting.
  • Operating Temperature Rated for operation from −40°C to 85°C (TA).
  • Memory Format FLASH memory format suitable for persistent on-board storage.

Unique Advantages

  • High-density on-board storage: 512 Gbit (64GB) capacity enables substantial local data storage within a single package.
  • Standard eMMC 5.1 interface: Simplifies integration into systems that support eMMC 5.1 host controllers.
  • Compact VFBGA footprint: 153-ball VFBGA (11.5 × 13 mm) balances density with board-space efficiency.
  • SLC NAND architecture: Provided SLC flash technology as specified for the device.
  • Extended temperature capability: −40°C to 85°C operating range supports deployments that require broader thermal tolerance.

Why Choose EMMC,5.1,153 BALL,64GB,-40C TO 8?

EMMC,5.1,153 BALL,64GB,-40C TO 8 positions itself as a high-density eMMC 5.1 storage option that pairs SLC NAND flash with a compact 153-ball VFBGA package. Its combination of 512 Gbit capacity, eMMC 5.1 interface, and extended temperature rating makes it suitable for designs that need integrated on-board FLASH memory while conserving PCB area.

This device is appropriate for engineers and procurement teams specifying embedded non-volatile storage where eMMC 5.1 compliance, package size, and operating temperature range are key selection criteria. The specification set supports straightforward integration and long-term inventory planning for projects requiring this exact configuration.

Request a quote or submit an inquiry for IMC1B1A8C1A0A1I3A8A0000 to receive pricing and availability information tailored to your project requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up