IMC1B1A8C2A2A1E3A8A0000

The IMC1B1A8C2A2A1E3A8A0000 is an embedded multimedia card (eMMC) device providing 512 Gbit (64GB) of non‑volatile SLC NAND flash memory in a 153‑ball VFBGA package (11.5 × 13 mm). The device implements the eMMC 5.1 interface and supports HS400/HS200 bus modes as documented in the product specification.

Designed for embedded storage and boot use, the device exposes features such as boot operation, field firmware update (FFU), power‑off notification for sleep, and extended CSD registers to support system configuration and firmware management. The package and operating range (‑25°C to 85°C) suit a range of embedded applications that require eMMC 5.1 connectivity and on‑board non‑volatile storage.

Key Features

• Memory Technology Single‑Level Cell (SLC) NAND flash memory providing non‑volatile storage.
• Density & Organization 512 Gbit total capacity organized as 64G × 8.
• eMMC 5.1 Interface Supports the eMMC 5.1 standard with HS400 and HS200 bus speed modes as specified in the datasheet.
• Boot & Firmware Support Includes boot operation mode and Field Firmware Update (FFU) functionality for firmware management and in‑field updates.
• Power Management Features Power‑off notification for sleep and enhanced user data area features for managed power and data integrity workflows.
• Package & Mechanical 153‑ball VFBGA package (153‑FBGA, 11.5 × 13 mm) with documented ball pattern and assignment in the datasheet.
• Configuration & Registers Extended CSD, CID, CSD and other eMMC registers supported for device identification and system configuration.
• Operating Temperature Rated for −25°C to 85°C ambient (TA).

Typical Applications

• Embedded system boot storage — Use the device's boot operation mode and user data area to host firmware and system boot images.
• On‑board mass storage for eMMC systems — eMMC 5.1 interface (HS400/HS200) provides a standard embedded storage option for designs that integrate eMMC devices.
• Industrial and temperature‑sensitive equipment — The −25°C to 85°C operating range supports deployment in environments with moderate temperature variation.

Unique Advantages

• Standards‑based interface: eMMC 5.1 support (including HS400/HS200 modes) enables integration with controllers and host stacks that target the eMMC standard.
• SLC NAND technology: Provided SLC NAND flash supports predictable non‑volatile storage behavior suitable for embedded firmware and user data.
• Comprehensive firmware management: Boot operation mode and FFU capabilities simplify firmware boot and in‑field update workflows.
• Robust configuration controls: Extended CSD, CID and CSD register support enables detailed device configuration and identification within the host system.
• Compact, documented package: 153‑ball VFBGA (11.5 × 13 mm) with full mechanical and ball‑assignment documentation for PCB integration.

Why Choose EMMC, 11.5X13 153 BALL, 64GB, -2?

This eMMC device combines SLC NAND non‑volatile memory with the eMMC 5.1 interface and documented HS400/HS200 bus modes, making it suitable for embedded designs that require standardized on‑board storage and firmware management features. The device's boot, FFU and power‑off notification features support controlled boot flows and in‑field firmware updates as described in the product documentation.

With 512 Gbit (64GB) capacity arranged as 64G × 8 and a compact 153‑ball VFBGA (11.5 × 13 mm) package, the IMC1B1A8C2A2A1E3A8A0000 is positioned for systems needing eMMC 5.1 connectivity, documented register/control options, and an ambient operating range of −25°C to 85°C.

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