IMC1B1A6C1A0A1I3A6A0000
| Part Description |
EMMC,5.1,153 BALL,32GB,-40C TO 8 |
|---|---|
| Quantity | 144 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Intelligent Memory Ltd. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Affected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8523.51.0000 |
Overview of IMC1B1A6C1A0A1I3A6A0000 – EMMC,5.1,153 BALL,32GB,-40C TO 8
The IMC1B1A6C1A0A1I3A6A0000 is an embedded non-volatile flash memory device using SLC NAND technology and an eMMC 5.1 interface. It provides 32GB of raw storage capacity (256 Gbit, organized as 32G × 8) in a compact 153-ball VFBGA package.
Designed for systems that require soldered, onboard storage with an industry-standard eMMC 5.1 interface, this device targets embedded storage applications where board-level integration and a defined operating temperature range are required.
Key Features
- Memory Type Non-volatile FLASH memory using NAND SLC technology for single-level cell storage.
- Capacity & Organization 32GB capacity (256 Gbit), organized as 32G × 8 to match common embedded storage addressing.
- Interface eMMC 5.1 memory interface for embedded system integration using standard eMMC protocols.
- Package 153-ball VFBGA (supplier device package listed as 153-FBGA, 11.5 × 13 mm) for board-level BGA mounting.
- Operating Temperature Range Specified for −40°C to 85°C (TA), supporting a broad thermal envelope for many embedded environments.
- Memory Format FLASH format suitable for persistent data storage in soldered, onboard implementations.
Typical Applications
- Embedded Storage Onboard non-volatile storage in systems that implement an eMMC 5.1 interface for firmware, file systems, or application data.
- Industrial Equipment Soldered FLASH storage for devices operating within the specified −40°C to 85°C temperature range.
- Compact Board-Level Designs Use in space-constrained PCBs where the 153-ball VFBGA (11.5 × 13 mm) package supports dense integration of storage.
Unique Advantages
- Standard eMMC 5.1 Interface: Provides a common embedded memory interface for straightforward integration into eMMC-capable host controllers.
- SLC NAND FLASH: Single-level cell architecture as specified for predictable flash cell organization.
- Defined Capacity and Organization: 32GB (256 Gbit) organized as 32G × 8 enables clear capacity planning and addressing for firmware and data storage.
- Compact VFBGA Package: 153-ball FBGA package (11.5 × 13 mm) minimizes PCB footprint while enabling board-level solder mounting.
- Wide Operating Temperature: Rated for −40°C to 85°C (TA), supporting deployment across a broad range of thermal conditions.
Why Choose IMC1B1A6C1A0A1I3A6A0000?
This IMC1B1A6C1A0A1I3A6A0000 device combines an eMMC 5.1 interface with SLC NAND FLASH in a compact 153-ball VFBGA package, offering a soldered 32GB storage option for embedded designs. The specified organization (32G × 8) and 256 Gbit capacity make it suitable for systems that require defined onboard storage and standard eMMC connectivity.
The device is appropriate for design teams seeking board-level integration of non-volatile FLASH within a −40°C to 85°C operating range and in applications that benefit from a small-footprint FBGA package.
Request a quote or contact sales to discuss availability, lead times, and pricing for IMC1B1A6C1A0A1I3A6A0000.
