IMC1B1A4C3A9A5E3A4A0000
| Part Description |
EMMC, 11.5X13 153 BALL, 8GB, -25 |
|---|---|
| Quantity | 1,655 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Intelligent Memory Ltd. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Affected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8523.51.1000 |
Overview of IMC1B1A4C3A9A5E3A4A0000 – eMMC 5.1 HS400, 8GB, 153-ball VFBGA (11.5×13 mm)
The IMC1B1A4C3A9A5E3A4A0000 is an embedded eMMC storage device implementing eMMC 5.1 with HS400/HS200 support in a 153-ball VFBGA package. It provides 8GB of flash storage (64 Gbit) using NAND SLC technology with an 8G × 8 organization.
This device is targeted for designs that require compact, board-mounted non-volatile storage with documented bus timing, register definitions, and package dimensions to support system integration and validation.
Key Features
- Memory Type & Technology Non-volatile FLASH memory using NAND (SLC) technology; memory organization specified as 8G × 8 for a total of 64 Gbit (8GB).
- Interface eMMC_5.1 interface with HS400 and HS200 bus speed modes as documented in the product specification.
- Package 153-ball VFBGA (153-FBGA) in an 11.5×13 mm footprint; package and ball assignment details are provided in the datasheet.
- Operating Temperature Specified operating ambient temperature range: −25°C to 85°C (TA).
- Device Functionality Includes documented eMMC features such as boot operation mode, device identification, interrupt mode, write cache, and field firmware update (FFU).
- Documentation Comprehensive datasheet content covers device performance, bus timing, register maps (CID/CSD/EXT_CSD), power-up sequencing, and HS200/HS400 timing specifications.
Unique Advantages
- Compact BGA footprint: 153-ball VFBGA in an 11.5×13 mm package provides a small-board footprint for embedded storage integration.
- Standards-based high-speed interface: eMMC 5.1 support with HS400/HS200 modes enables designs to use defined high-speed bus modes as documented for system timing.
- Clear implementation guidance: Datasheet includes bus operating conditions, timing tables, and package/ball assignment diagrams to aid PCB design and validation.
- Defined thermal range: Specified −25°C to 85°C operating range supports deployments that operate across that temperature span.
- Embedded flash format: Integrated eMMC memory format (8GB) reduces the need for separate controller-memory componentization in board-level designs.
Why Choose IMC1B1A4C3A9A5E3A4A0000?
This 8GB eMMC device combines eMMC 5.1 interface support with SLC NAND flash in a compact 153-ball VFBGA package, backed by detailed datasheet coverage of bus timing, register definitions, power-up sequencing, and package dimensions. The specification set supports engineering evaluation and system-level integration for designs requiring embedded non-volatile storage within the stated temperature range.
The device is suited to programs that require a documented eMMC 5.1 implementation and package-level detail for board design and validation, providing clear technical references for timing, bus operation, and device registers.
Request a quote or submit a product inquiry to get pricing, lead time, and availability for the IMC1B1A4C3A9A5E3A4A0000 eMMC module.
