IMC1B1A8C2A2A1E3A6A0000

The IMC1B1A8C2A2A1E3A6A0000 is an Embedded Multimedia Card (eMMC) device implementing the eMMC 5.1 interface in a 153-ball VFBGA package (11.5 × 13 mm). It provides 256 Gbit (32 GB) of non-volatile NAND (SLC) flash organized as 32G × 8 and is designed for systems that require on-board eMMC storage with HS400/HS200 bus support as documented in the product specification.

Key attributes exposed in the specification include a compact 153-FBGA footprint, eMMC 5.1 protocol support, SLC NAND technology, and an operating ambient temperature range of -25°C to 85°C.

Key Features

• Memory Type: Non-volatile flash NAND (SLC) technology for data retention and byte-addressed storage using eMMC protocol.
• Capacity & Organization: 256 Gbit total capacity, organized as 32G × 8—delivering 32 GB usable density per device.
• Interface: eMMC 5.1 compliant interface with documented HS400 and HS200 bus speed modes in the product specification.
• Package: 153-ball VFBGA (153-FBGA) with a 11.5 × 13 mm footprint for compact board-level integration; detailed package and ball assignment are provided in the device documentation.
• Operating Temperature: Specified ambient range of -25°C to 85°C (TA) for applications within that thermal envelope.
• eMMC Functionality: Device-level features covered in the specification include boot operation mode, device identification mode, interrupt mode, data transfer and inactive modes, field firmware update (FFU), power-off notification for sleep, and enhanced user data area support.
• Documentation Coverage: Comprehensive device specification sections cover registers (OCR, CID, CSD, EXT_CSD), bus timing (HS200/HS400), power-up sequencing, and signal-level/timing diagrams.

Typical Applications

• Embedded storage systems: On-board non-volatile storage for systems that require eMMC 5.1 connectivity and managed NAND flash in a compact package.
• Compact module integration: Devices and modules where a 153-ball VFBGA (11.5 × 13 mm) footprint supports space-constrained board designs.
• Systems requiring managed flash features: Designs that make use of eMMC functions such as boot mode, field firmware update (FFU), and enhanced user data areas as documented in the specification.

Unique Advantages

• Standards-based interface: eMMC 5.1 compliance provides a documented protocol and bus speed modes (HS400/HS200) as described in the specification.
• SLC NAND technology: Use of SLC NAND flash provides the device-level memory technology identified in the product data.
• High-density storage in a small package: 256 Gbit (32 GB) organized as 32G × 8 in a 153-ball VFBGA (11.5 × 13 mm) enables high capacity with compact board footprint.
• Operational temperature range: Rated for -25°C to 85°C (TA), supporting deployments within that ambient temperature window.
• Comprehensive device documentation: Detailed specification covers registers, bus timing, power sequencing, package dimensions, and feature descriptions (boot, FFU, power-off notification), supporting system integration and validation.

Why Choose EMMC, 11.5X13 153 BALL, 32GB, -2?

The IMC1B1A8C2A2A1E3A6A0000 positions itself as a compact, standards-based eMMC 5.1 storage option delivering 256 Gbit (32 GB) of SLC NAND in a 153-ball VFBGA package. Its documented support for HS400/HS200 speed modes, boot and firmware update features, and comprehensive register and timing documentation make it suitable for designs that require integrated eMMC storage with clear hardware and protocol specifications.

This device is appropriate for engineers and procurement teams looking for a documented eMMC 5.1 solution with a small footprint and defined operating temperature range, backed by detailed package, signal and timing information to support integration and validation efforts.

If you need pricing, lead-time or a formal quote for IMC1B1A8C2A2A1E3A6A0000, request a quote or contact the sales channel to discuss availability and ordering details.