IS42S16160B-6T-TR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 90 Available (as of May 4, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S16160B-6T-TR - 256Mbit Synchronous DRAM Module

The IS42S16160B-6T-TR is a 256-megabit Synchronous Dynamic Random Access Memory (SDRAM) module organized as 16 million words by 16 bits. This high-density volatile memory component operates at clock frequencies up to 166MHz, delivering fast data access with a 5.4ns access time. Designed for embedded systems and computing applications requiring cost-effective, high-performance temporary data storage, this SDRAM provides an ideal balance of speed, capacity, and power efficiency.

Key Features

  • High-Density Memory Architecture - 256Mbit capacity organized as 16M x 16 provides substantial temporary storage for data-intensive applications while maintaining a compact footprint in space-constrained designs.
  • Synchronous Operation - SDRAM technology with 166MHz clock frequency enables synchronized data transfers with system controllers, reducing latency and improving overall system throughput compared to asynchronous memory.
  • Parallel Interface - Direct parallel data bus connection simplifies integration with microcontrollers, processors, and FPGAs without requiring complex serial protocol management.
  • Standard Operating Voltage - 3V to 3.6V supply voltage range ensures compatibility with common 3.3V logic families and reduces power consumption compared to legacy 5V memory devices.
  • 54-TSOP II Package - Industry-standard 54-pin Thin Small Outline Package with 10.16mm width enables high-density PCB layouts and automated assembly processes.
  • Commercial Temperature Range - 0°C to 70°C operating temperature suits standard indoor commercial and consumer electronics applications.

Typical Applications

  • Embedded Computing Systems - This SDRAM serves as main system memory in embedded computers, single-board computers, and industrial controllers where the 256Mbit capacity supports operating systems and application code execution while the fast access time ensures responsive performance.
  • Consumer Electronics - Set-top boxes, digital video recorders, and multimedia devices utilize this memory for buffering video streams and caching user interface data, with the parallel interface simplifying integration with media processors.
  • Network Equipment - Routers, switches, and network appliances employ this SDRAM for packet buffering and routing table storage, where the synchronous operation aligns with system clocks to maintain consistent data throughput.
  • Test and Measurement Instruments - Oscilloscopes and data acquisition systems leverage this memory for waveform storage and sample buffering, with the 166MHz clock supporting real-time data capture requirements.
  • Legacy System Upgrades - Replacement or expansion memory for existing designs originally using similar SDRAM specifications, maintaining compatibility with established architectures.

Unique Advantages

  • Cost-Effective High Density: Provides 256Mbit capacity at competitive pricing for applications where proven SDRAM technology meets performance requirements without the premium cost of newer memory types.
  • Simplified System Design: Parallel interface and standard SDRAM protocol reduce controller complexity compared to newer memory technologies, shortening design cycles and lowering development costs.
  • Broad Controller Support: Compatible with widely-available SDRAM controllers in microprocessors, FPGAs, and dedicated memory controller ICs, leveraging mature design tools and reference implementations.
  • Reliable Volatile Storage: SDRAM architecture provides fast read/write cycles without endurance limitations of non-volatile memory, suitable for temporary data storage with unlimited rewrite capability.
  • Standard Manufacturing: TSOP II package format supports automated pick-and-place assembly and established rework procedures, reducing manufacturing complexity and improving yield rates.
  • Power Efficiency: 3.3V operation consumes less power than legacy 5V memory devices, contributing to lower system power budgets and reduced thermal management requirements in battery-powered or thermally-constrained applications.

Why Choose IS42S16160B-6T-TR?

The IS42S16160B-6T-TR represents a reliable choice for designs requiring proven SDRAM technology with established supply chains and broad technical support. Its standard architecture and packaging make it suitable for both new designs where cost-effectiveness is paramount and for maintaining existing product lines. Engineering teams benefit from extensive documentation, mature controller IP, and widespread familiarity with SDRAM integration practices.

For applications operating within commercial temperature ranges and requiring moderate memory density, this component offers a straightforward implementation path with predictable performance characteristics and competitive pricing.

Get a Quote

Contact our sales team to discuss pricing, availability, and volume discounts for the IS42S16160B-6T-TR. Our technical support staff can assist with integration questions, reference design recommendations, and controller selection to ensure successful implementation in your application.

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