IS42S16160J-6TI
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 706 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS42S16160J-6TI – IC DRAM 256MBIT PAR 54TSOP II
The IS42S16160J-6TI is a volatile SDRAM device providing 256 Mbit of parallel DRAM memory in a 16M × 16 organization. It implements a standard parallel SDRAM architecture with a 166 MHz clock frequency and an access time of 5.4 ns.
Packaged in a 54‑lead TSOP II (0.400", 10.16 mm width) and specified for operation from -40°C to 85°C (TA), this device is intended for systems that require external parallel SDRAM for working memory and buffering at 3.0 V–3.6 V supply levels.
Key Features
- Core / Memory Architecture SDRAM architecture with a memory organization of 16M × 16, yielding a total density of 256 Mbit.
- Performance Rated clock frequency of 166 MHz and an access time of 5.4 ns for fast read/write cycles within the specified timing envelope.
- Interface Standard parallel memory interface suitable for systems designed to use parallel DRAM modules.
- Power Operates from a 3.0 V to 3.6 V supply range.
- Package 54‑lead TSOP II package (0.400", 10.16 mm width) in a compact surface-mount form factor.
- Temperature Range Specified operating temperature: -40°C to 85°C (TA).
- Memory Type Volatile DRAM format intended for temporary storage and buffering.
Typical Applications
- Embedded systems — Provides parallel SDRAM capacity for application code working memory and data buffering.
- Networking and communications equipment — Supports frame buffering and packet processing where parallel SDRAM is required.
- Consumer electronics — Used as external volatile memory for devices that require a 16‑bit data bus and 256 Mbit capacity.
- Industrial control — Offers extended temperature operation for systems needing external SDRAM storage in embedded controllers.
Unique Advantages
- Deterministic parallel interface: The parallel SDRAM organization (16M × 16) simplifies integration with systems designed for 16‑bit external DRAM buses.
- Balanced performance: 166 MHz clock rating combined with a 5.4 ns access time enables responsive memory operations for typical SDRAM use cases.
- Wide supply tolerance: Operation from 3.0 V to 3.6 V accommodates designs using standard 3 V power rails.
- Compact board footprint: 54‑lead TSOP II package (0.400", 10.16 mm width) provides a surface-mount option for space-constrained PCBs.
- Extended temperature support: Rated for -40°C to 85°C (TA) to suit a range of ambient operating conditions.
Why Choose IC DRAM 256MBIT PAR 54TSOP II
The IS42S16160J-6TI positions itself as a straightforward, specification-driven parallel SDRAM device delivering 256 Mbit of volatile memory with a 16M × 16 organization. Its combination of 166 MHz clock capability, 5.4 ns access time, and a 3.0 V–3.6 V supply window makes it suitable for designs that require predictable SDRAM performance in a compact 54‑lead TSOP II package.
This device is well suited to engineers specifying external SDRAM for embedded systems, networking equipment, consumer devices, and industrial controllers where a 16‑bit parallel interface and extended temperature operation are required. Its clear electrical and mechanical specifications support reliable system integration and long-term design planning.
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