IS42S16160J-6BLI-TR
| Part Description |
IC DRAM 256MBIT PAR 54TFBGA |
|---|---|
| Quantity | 1,228 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS42S16160J-6BLI-TR – IC DRAM 256MBIT PAR 54TFBGA
The IS42S16160J-6BLI-TR is a volatile SDRAM device providing 256 Mbit of parallel DRAM memory in a 16M × 16 organization. It implements a parallel memory interface with a clock frequency of 166 MHz and an access time of 5.4 ns, delivering deterministic synchronous memory performance.
Built for board-level integration, the device operates from a 3V ~ 3.6V supply and is offered in a 54-TFBGA (8×8) package with an operating temperature range of −40°C to 85°C, making it suitable for systems requiring defined SDRAM capacity and standard commercial temperature operation.
Key Features
- Memory Type 256 Mbit SDRAM organized as 16M × 16, provided as volatile parallel DRAM for standard synchronous memory applications.
- Performance Clock frequency rated at 166 MHz with a listed access time of 5.4 ns, supporting synchronous parallel memory timing requirements.
- Voltage Operates from 3V ~ 3.6V supply voltage range as specified for device power.
- Package Available in a 54-TFBGA (8×8) package, providing a compact BGA footprint for surface-mount integration.
- Operating Temperature Specified operating temperature range of −40°C to 85°C (TA), covering standard industrial and commercial temperature conditions.
- Interface Parallel memory interface using standard DRAM signaling and organization (16-bit data width) for direct memory mapping.
Typical Applications
- Parallel memory subsystems — Use where a 256 Mbit parallel SDRAM (16M × 16) is required for synchronous data storage and retrieval.
- Board-level SDRAM expansion — Integrate as on-board DRAM to provide defined volatile storage in systems designed around parallel memory interfaces.
- Embedded system memory — Add deterministic SDRAM capacity for designs that use a standard 16-bit parallel memory bus and require the specified clock and access timing.
Unique Advantages
- Deterministic SDRAM timing — 166 MHz clock frequency and 5.4 ns access time enable predictable synchronous memory behavior for timing-sensitive designs.
- Compact BGA footprint — 54-TFBGA (8×8) package minimizes board area while providing BGA-level soldering for reliable interconnection.
- Wide supply tolerance — 3V ~ 3.6V operating range accommodates common 3V-class power rails.
- Industrial temperature range — Specified operation from −40°C to 85°C supports deployment across standard commercial and industrial ambient conditions.
- Parallel 16-bit organization — 16M × 16 memory organization matches designs expecting a 16-bit data path for straightforward system integration.
Why Choose IS42S16160J-6BLI-TR?
The IS42S16160J-6BLI-TR positions itself as a straightforward SDRAM option when a 256 Mbit, 16-bit parallel memory solution is required. Its specified 166 MHz clock and 5.4 ns access time provide defined synchronous performance, while the 54-TFBGA package and 3V–3.6V supply support compact board-level integration with common power architectures.
This device is well suited for designs that require a fixed-capacity parallel DRAM component with clear electrical and thermal specifications. Its operating temperature range and package type support reliable assembly and operation across typical commercial and industrial environments.
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