IS42S32800G-7BL-TR

IC DRAM 256MBIT PAR 90TFBGA
Part Description

IC DRAM 256MBIT PAR 90TFBGA

Quantity 294 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package90-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging90-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S32800G-7BL-TR – IC DRAM 256Mbit PAR 90TFBGA

The IS42S32800G-7BL-TR is a 256Mbit synchronous DRAM organized as 8M × 32 with a quad-bank architecture and pipeline design for high-speed data transfer. It is a parallel-interface SDRAM device offered in a 90-ball TF-BGA (8×13) package and is intended for commercial temperature operation (0°C to +70°C).

This device supports standard SDRAM features—programmable burst lengths and sequences, selectable CAS latencies, auto- and self-refresh—and is designed for board-level memory subsystems operating from a 3.3V supply range.

Key Features

  • Memory Core 256 Mbit capacity, organized as 8M × 32 and internally configured as 2M × 32 × 4 banks for parallel SDRAM operation.
  • Synchronous SDRAM Architecture Fully synchronous operation with all signals referenced to the rising edge of the clock; pipeline architecture for high-speed transfers.
  • Performance -7 timing option supports a clock frequency of 143 MHz with an access time from clock of 5.4 ns; device family also offers 166 MHz and 200 MHz options.
  • Programmable Burst and Latency Programmable burst lengths (1, 2, 4, 8, full page) and programmable burst sequence (sequential/interleave); selectable CAS latency of 2 or 3 clocks.
  • Refresh and Self-Refresh Auto Refresh (CBR) and Self Refresh supported; 4096 refresh cycles with timing options of 16 ms (A2 grade) or 64 ms (commercial/A1/industrial options as specified).
  • Interface and Signaling LVTTL-compatible interface for command and control signals; random column address capability every clock cycle for rapid access patterns.
  • Power Single power supply operation at 3.3V ±0.3V (documented supply range 3.0 V to 3.6 V).
  • Package and Mounting 90-ball TF-BGA (8×13) package suitable for board-level mounting in compact designs.
  • Operating Range Commercial temperature range listed as 0°C to +70°C (TA) for the specified commercial-grade device.

Typical Applications

  • Embedded systems Used as board-level SDRAM for embedded platforms that require a 256 Mbit parallel memory with synchronous operation.
  • High-speed data buffering Provides pipeline-capable buffering in digital subsystems where predictable, clock-referenced access timing is required.
  • Consumer electronics Suited for commercial-temperature consumer devices needing 256Mbit SDRAM in a compact 90-TFBGA footprint.

Unique Advantages

  • Selectable performance modes: Multiple timing options (200, 166, 143 MHz) and CAS latency settings allow designers to match speed and timing to system requirements.
  • Flexible burst control: Programmable burst lengths and sequential/interleave burst sequencing simplify memory access patterns and performance tuning.
  • Quad-bank architecture: Four internal banks support hidden row access/precharge for improved effective throughput in burst and random access scenarios.
  • Standard 3.3V power: Operates from a 3.3V single supply (3.0–3.6V range), aligning with common system memory power rails.
  • Compact BGA package: 90-ball TF-BGA (8×13) package reduces board footprint while providing a robust mounting option for surface-mount assemblies.
  • Refresh and low-power options: Supports Auto Refresh and Self Refresh modes with documented refresh counts and timing options for different grade requirements.

Why Choose IS42S32800G-7BL-TR?

The IS42S32800G-7BL-TR delivers a straightforward 256Mbit synchronous DRAM solution in an 8M × 32 organization for designers needing predictable, clock-referenced memory performance. With programmable burst behavior, selectable CAS latency, and quad-bank architecture, it provides the timing flexibility and throughput control required for a range of commercial applications.

Packaged in a compact 90-TF BGA and specified for 3.3V systems at commercial temperature range, this ISSI device is appropriate for board-level memory subsystems where a documented SDRAM feature set and standard signaling are required.

Request a quote or submit a quote for the IS42S32800G-7BL-TR to obtain pricing and availability information.

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