IS42S32800G-6BL-TR
| Part Description |
IC DRAM 256MBIT PAR 90TFBGA |
|---|---|
| Quantity | 1,188 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS42S32800G-6BL-TR – IC DRAM 256MBIT PAR 90TFBGA
The IS42S32800G-6BL-TR is a 256 Mbit synchronous DRAM organized as 8M × 32 with a quad-bank architecture and pipeline data transfer. It provides a parallel LVTTL interface and is designed for high-speed system memory applications that require a 3.0 V–3.6 V supply and a 90-ball thin fine-pitch BGA package.
This device supports programmable burst lengths and CAS latency options to match a range of system timing needs, with a rated clock frequency of 166 MHz and an access time of 5.4 ns for the -6 speed grade.
Key Features
- Core / Architecture Quad-bank synchronous DRAM with pipeline architecture; all signals referenced to the rising clock edge for deterministic timing.
- Memory Organization 256 Mbit capacity organized as 8M × 32 (2M × 32 × 4 banks) to support wide 32-bit parallel data paths.
- Performance -6 speed grade: 166 MHz clock frequency and 5.4 ns access time (CAS latency = 3) for high-rate burst transfers.
- Programmable Timing and Burst Programmable CAS latency (2 or 3 clocks), programmable burst lengths (1, 2, 4, 8, full page) and selectable sequential/interleave burst sequences.
- Power Single power supply operation with VDD/VDDQ in the 3.0 V to 3.6 V range.
- Interface Parallel LVTTL interface supporting random column access every clock cycle and standard SDRAM command set (burst read/write, auto-precharge, burst termination).
- Refresh and Reliability Auto Refresh and Self Refresh supported; commercial-grade refresh cycle: 4096 cycles every 64 ms.
- Package and Temperature 90-ball TF‑BGA (8 × 13) package, commercial operating temperature range 0°C to +70°C (TA).
Typical Applications
- System Memory for Embedded Platforms Provides 32-bit parallel SDRAM capacity for embedded controllers, set-top boxes, and other devices requiring synchronous DRAM.
- Display and Multimedia Buffers Suitable for frame buffering and burst-oriented data streams where programmable burst lengths and CAS latency tuning are needed.
- Legacy Parallel SDRAM Designs Direct replacement in systems designed around 3.3 V parallel SDRAM interfaces and TF‑BGA mounting.
Unique Advantages
- Deterministic Synchronous Interface: Signals referenced to the rising clock edge simplify timing analysis and integration into synchronous memory buses.
- Flexible Burst and Latency Options: Programmable burst lengths and CAS latencies allow designers to tune performance to system access patterns.
- Wide 32-bit Data Path: 8M × 32 organization supports efficient 32-bit parallel transfers for bus-aligned applications.
- Industry-Standard Voltage Range: 3.0 V–3.6 V single-supply operation matches common 3.3 V system rails for straightforward power integration.
- Compact BGA Package: 90-TF‑BGA (8×13) package offers a small-footprint mounting option for space-constrained boards.
Why Choose IS42S32800G-6BL-TR?
The IS42S32800G-6BL-TR offers a practical balance of capacity, speed, and interface compatibility for designs that require 256 Mbit of synchronous DRAM in a 32-bit parallel configuration. Its programmable timing and burst options, combined with a 166 MHz speed grade and supported refresh modes, make it suitable for systems that demand predictable SDRAM behavior and straightforward integration on 3.3 V platforms.
This device is aimed at engineers and procurement teams implementing commercial-grade embedded and multimedia systems where compact TF‑BGA packaging, LVTTL parallel interfacing, and standard SDRAM command support are required.
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