IS42S83200B-7TLI-TR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 578 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S83200B-7TLI-TR - 256Mbit SDRAM with Extended Temperature Range

The IS42S83200B-7TLI-TR is a 256-megabit synchronous dynamic random access memory (SDRAM) from ISSI, Integrated Silicon Solution Inc. Organized as 32M x 8 bits, this parallel SDRAM operates at a 143 MHz clock frequency with a fast 5.4ns access time. Designed for industrial applications requiring reliable memory performance across extended temperature ranges, this device operates from -40°C to 85°C. Its 3V to 3.6V supply voltage and standard TSOP II package make it a practical choice for embedded systems, telecommunications equipment, and industrial control applications where volatile memory with predictable performance is essential.

Key Features

  • Memory Architecture - 256Mbit capacity organized as 32M x 8, providing flexible byte-wide data access for parallel processor interfaces and memory subsystems.
  • Clock and Timing Performance - 143 MHz maximum clock frequency with 5.4ns access time delivers responsive data throughput for real-time control and embedded processing applications.
  • Power Supply - Operates on standard 3V to 3.6V supply, compatible with common 3.3V system architectures without requiring level shifters or additional regulators.
  • Temperature Range - Extended -40°C to 85°C operating temperature range ensures reliable operation in industrial environments subject to thermal extremes.
  • Package Format - 54-pin TSOP II package (10.16mm width) provides a compact footprint suitable for space-constrained PCB designs.
  • Interface Type - Parallel SDRAM interface simplifies integration with processors and controllers using traditional memory bus architectures.

Typical Applications

  • Industrial Automation Systems - This SDRAM provides working memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and motion control systems where the extended temperature range ensures consistent operation in factory floor conditions.
  • Telecommunications Equipment - The parallel SDRAM architecture supports buffering and data processing in routers, switches, and base station controllers where predictable latency and moderate bandwidth are required.
  • Embedded Computing Platforms - With its 32M x 8 organization and 3.3V operation, this device serves as main memory for ARM, MIPS, or other embedded processors in industrial computers and edge computing nodes.
  • Test and Measurement Instruments - The fast access time and extended temperature tolerance make this SDRAM suitable for data acquisition systems, oscilloscopes, and industrial test equipment operating in varied environmental conditions.

Unique Advantages

  • Proven SDRAM Technology: Synchronous DRAM architecture offers well-understood design integration with extensive driver support and predictable behavior across operating conditions.
  • Extended Temperature Reliability: -40°C to 85°C range reduces the need for environmental controls in industrial installations, lowering system costs and improving deployment flexibility.
  • Standard Voltage Operation: 3V to 3.6V supply voltage eliminates complex power management requirements and integrates directly into established 3.3V system designs.
  • Compact Physical Footprint: 54-TSOP II package provides a space-efficient solution for memory expansion without consuming excessive PCB area.
  • Byte-Wide Organization: 32M x 8 architecture matches common 8-bit and 16-bit processor bus widths, simplifying memory controller design and reducing external logic requirements.

Why Choose IS42S83200B-7TLI-TR?

The IS42S83200B-7TLI-TR is positioned for industrial and embedded applications where extended temperature operation, proven SDRAM technology, and parallel interface compatibility are design priorities. With 256Mbit density in a byte-wide configuration, this device fits well into systems requiring moderate memory capacity without the complexity of newer memory technologies. The TSOP II package and standard 3.3V operation facilitate integration into existing designs and support cost-effective manufacturing.

Note that this part carries an Obsolete lifecycle status. Designers should consider this component for existing design support, repair inventory, or legacy system maintenance rather than new product development. For new designs requiring similar specifications, contact your ISSI representative or authorized distributor for current product recommendations.

Contact Us for Availability

To inquire about current stock availability for the IS42S83200B-7TLI-TR or to explore alternative solutions for your memory requirements, please request a quote through our sales team. Our technical specialists can assist with cross-reference recommendations and provide guidance on suitable replacements for legacy designs.

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