IS42S83200D-6TLI-TR

The IS42S83200D-6TLI-TR is a 256-Mbit synchronous DRAM (SDRAM) organized as 32M x 8 with a parallel memory interface and pipeline architecture for high-speed data transfer. It operates from a single 3.3V supply and supports programmable CAS latency, burst read/write modes, and internal bank management to optimize throughput.

Designed for systems requiring compact, fast volatile memory, this device is offered in a 54-pin TSOP-II package and supports industrial temperature operation, making it suitable for embedded and industrial applications that need reliable synchronous DRAM performance.

Key Features

• Memory Configuration  32M x 8 organization delivering 256 Mbit of SDRAM in a single device.
• High-speed Synchronous Operation  Fully synchronous architecture with clocked inputs referenced to the rising edge; supported clock frequency up to 166 MHz (–6 speed grade) and access time as low as 5.4 ns (CAS latency = 3).
• Power  Single power supply: 3.3V ±0.3V (specified supply range 3.0V to 3.6V).
• programmable burst and CAS  Programmable burst lengths (1, 2, 4, 8, full page), selectable sequential/interleave burst sequences, and programmable CAS latency (2 or 3 clocks) to match system timing needs.
• Refresh and Low-power Modes  Supports auto-refresh (CBR) and self-refresh; refresh options include 8K cycles per 16 ms (A2 grade) or 64 ms (commercial/industrial/A1 grade).
• Internal Bank Management  Internal banking hides row access/precharge latency and enables random column addressing every clock cycle for improved data throughput.
• Interface  LVTTL-compatible interface with burst read/write and burst read/single write capability; supports burst termination via burst stop and precharge.
• Package and Temperature  Available in a 54-pin TSOP-II (0.400", 10.16 mm width) package; operating temperature specified from −40°C to +85°C (TA).

Typical Applications

• Embedded Systems  Used as synchronous DRAM storage in embedded controllers and data buffering where a parallel SDRAM interface and compact TSOP-II footprint are required.
• Industrial Equipment  Provides volatile memory for industrial systems that require operation across −40°C to +85°C and need self-refresh/auto-refresh capabilities.
• High-speed Data Buffers  Suitable for designs that need pipeline architecture and internal bank management to support continuous high-throughput read/write operations.

Unique Advantages

• High clock-rate support: The –6 speed grade supports up to 166 MHz operation, enabling lower access latencies and higher data rates.
• Flexible burst control: Programmable burst lengths and sequences let designers tune transfer patterns for sequential or interleaved access to match system workloads.
• Robust refresh options: Auto-refresh and self-refresh modes with selectable refresh periods (8K/16 ms or 8K/64 ms) help maintain data integrity in diverse operating conditions.
• Compact, industry-ready package: 54-pin TSOP-II package provides a small footprint for space-constrained PCBs while supporting industrial temperature operation.
• Reduced row/column latency: Internal bank architecture hides row access/precharge delays and supports random column addressing every clock cycle for efficient access patterns.
• Standard supply compatibility: Operates from a 3.3V single supply (3.0–3.6V range) and uses LVTTL signaling for straightforward integration with common logic families.

Why Choose IC DRAM 256MBIT PAR 54TSOP II?

The IS42S83200D-6TLI-TR delivers a practical combination of speed, flexibility, and form factor for designs that require 256 Mbit of synchronous DRAM in a TSOP-II package. Its programmable CAS latency, burst modes, and internal bank management make it well suited for applications demanding predictable, high-throughput memory access.

This part is appropriate for engineers designing compact embedded or industrial systems that need a single-supply 3.3V SDRAM solution with industrial temperature capability and standard LVTTL interfacing. The device’s refresh and low-power modes add reliability for systems that may experience extended idle periods or varied operating conditions.

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