IS42S83200J-7BLI-TR
| Part Description |
IC DRAM 256MBIT PAR 54TFBGA |
|---|---|
| Quantity | 221 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS42S83200J-7BLI-TR – 256Mbit SDRAM, Parallel, 54-TFBGA
The IS42S83200J-7BLI-TR is a 256 Mbit volatile SDRAM organized as 32M × 8 with a parallel memory interface, supplied in a 54-TFBGA (8×8) package. It targets applications requiring external parallel DRAM storage with standard SDRAM signaling.
Key electrical and timing characteristics include a clock frequency of 143 MHz, an access time of 5.4 ns, an operating voltage range of 3.0 V to 3.6 V, and an ambient operating range of −40 °C to 85 °C, making it suitable for designs that require moderate-speed parallel DRAM operating across commercial and extended temperature conditions.
Key Features
- Memory Core: 256 Mbit SDRAM organized as 32M × 8, providing a conventional parallel DRAM memory map for system designs.
- Technology & Interface: SDRAM technology with a parallel memory interface suitable for external DRAM memory subsystems.
- Performance: Clock frequency up to 143 MHz with an access time of 5.4 ns to support moderate-speed data transactions.
- Power Supply: Operates from 3.0 V to 3.6 V, enabling compatibility with common 3 V power domains.
- Package & Mounting: 54-TFBGA (8×8) package, surface-mount form factor suited for compact board-level integration.
- Operating Temperature: Specified ambient range of −40 °C to 85 °C (TA) for use in temperature-variable environments.
- Volatile Memory Type: Standard volatile DRAM device for applications that require temporary data storage.
Typical Applications
- Parallel memory subsystems — for system designs that require external SDRAM configured in a 32M × 8 organization with a parallel interface.
- Embedded systems with external DRAM — where moderate-speed volatile storage and a compact ball-grid package are needed.
- Board-level memory expansion — adding parallel SDRAM capacity to processing platforms that accept 54-TFBGA footprint devices.
Unique Advantages
- Standard memory organization: 32M × 8 arrangement simplifies address mapping and system integration with parallel DRAM controllers.
- Moderate-speed timing: 143 MHz clock frequency and 5.4 ns access time provide predictable performance for designs targeting this class of SDRAM.
- Wide supply tolerance: 3.0 V to 3.6 V operation supports common 3 V rail power domains and simplifies power-supply design choices.
- Compact BGA package: 54-TFBGA (8×8) package offers a small board footprint for space-constrained applications.
- Extended ambient range: −40 °C to 85 °C operating specification enables deployment across a broad set of environmental conditions.
Why Choose IS42S83200J-7BLI-TR?
The IS42S83200J-7BLI-TR positions itself as a straightforward, industry-standard 256 Mbit SDRAM device for systems needing parallel volatile memory in a compact 54-TFBGA package. Its combination of 32M × 8 organization, 143 MHz clocking, and 3.0–3.6 V operation makes it suitable for designers who require predictable SDRAM timing and board-level density without introducing nonstandard interfaces.
This device is appropriate for engineers and procurement teams specifying parallel SDRAM for embedded or board-level memory expansion, offering a clear set of electrical and thermal specifications to plan power, timing, and thermal management with confidence.
Request a quote or contact sales to obtain pricing, lead-time and additional technical information for the IS42S83200J-7BLI-TR.