IS42S83200J-6TLI
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 110 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS42S83200J-6TLI – IC DRAM 256MBIT PAR 54TSOP II
The IS42S83200J-6TLI is a 256 Mbit volatile SDRAM organized as 32M × 8 with a parallel memory interface. It delivers synchronous DRAM operation at a clock frequency up to 166 MHz with an access time of 5.4 ns, targeted for designs that require compact, board-level dynamic memory.
Available in a 54‑lead TSOP II package (0.400" / 10.16 mm width) and rated for operation from −40°C to 85°C, this device is suited for applications that need a standardized SDRAM form factor, defined supply range, and predictable timing characteristics.
Key Features
- Memory Core 256 Mbit SDRAM organized as 32M × 8, providing a standard DRAM memory format for system memory implementations.
- Performance Synchronous DRAM with a clock frequency up to 166 MHz and a specified access time of 5.4 ns for predictable timing behavior.
- Interface Parallel memory interface suitable for conventional SDRAM system designs and memory controller integration.
- Power Operates from a supply voltage range of 3.0 V to 3.6 V, matching common 3 V SDRAM power rails.
- Package 54‑lead TSOP II (0.400", 10.16 mm width) surface-mount package for compact PCB implementations.
- Temperature Range Specified for operation from −40°C to 85°C (TA), accommodating a wide ambient temperature span.
Typical Applications
- Embedded system memory — Provides 256 Mbit of SDRAM capacity for embedded platforms that require board-level dynamic memory.
- Consumer electronics — Fits applications needing compact, parallel SDRAM in a 54‑TSOP II package within the supplied voltage range.
- Industrial equipment — Usable in systems operating across −40°C to 85°C where a standard SDRAM footprint and timing are required.
Unique Advantages
- Standard SDRAM organization: 32M × 8 layout simplifies mapping with common memory controllers and software expectations.
- Clear performance parameters: 166 MHz clock frequency and 5.4 ns access time provide defined timing for deterministic system design.
- Wide ambient temperature range: −40°C to 85°C rating supports deployment in varied environmental conditions.
- Compact TSOP II package: 54‑lead 0.400" (10.16 mm) TSOP II footprint enables high-density PCB layouts.
- 3.0–3.6 V supply compatibility: Matches common 3 V SDRAM power rails for straightforward power design.
Why Choose IS42S83200J-6TLI?
IS42S83200J-6TLI offers a straightforward SDRAM solution with explicit electrical and timing specifications—256 Mbit capacity, 32M × 8 organization, 166 MHz clocking, and 5.4 ns access time—packaged in a compact 54‑lead TSOP II. Its defined supply range and wide operating temperature make it suitable for designs that require predictable, board-level dynamic memory behavior.
This device is appropriate for engineers and procurement teams specifying standard SDRAM capacity and timing for embedded, consumer, or industrial systems where a 54‑TSOP II package and 3.0–3.6 V operation are required.
Request a quote or submit a parts inquiry to confirm availability and pricing for IS42S83200J-6TLI.
