IS42S83200L-6TL
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 70 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | LVTTL | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of IS42S83200L-6TL – 256 Mbit SDRAM (54-TSOP II)
The IS42S83200L-6TL from ISSI is a 256 Mbit volatile SDRAM organized as 32M x 8. It provides synchronous DRAM memory with a 166 MHz clock frequency and a 5.4 ns access time for temporary data storage in electronic systems.
Designed for board-level integration, the device operates from a 3.0 V to 3.6 V supply, uses an LVTTL memory interface, and is supplied in a 54-TSOP II (0.400", 10.16 mm width) package with an operating ambient temperature range of 0°C to 70°C.
Key Features
- Memory Core 256 Mbit SDRAM organized as 32M x 8 for volatile data storage and transient memory needs.
- Performance Operates with a clock frequency of 166 MHz and an access time of 5.4 ns to support fast synchronous memory transactions.
- Interface Standard LVTTL memory interface for integration with compatible logic-level systems.
- Power Single-supply operation from 3.0 V to 3.6 V to match typical 3 V system power rails.
- Package & Temperature Supplied in a 54-TSOP II (0.400", 10.16 mm width) package; specified operating ambient temperature range is 0°C to 70°C.
Typical Applications
- Memory expansion for embedded systems Provides 256 Mbit of volatile SDRAM (32M x 8) for designs that require external synchronous memory with an LVTTL interface.
- Data buffering and temporary storage 166 MHz clocking and 5.4 ns access time make the device suitable for temporary buffering and frame storage where synchronous DRAM is required.
- Compact board-level integration The 54-TSOP II package and 3.0–3.6 V supply range support space-constrained PCB designs operating within a 0°C to 70°C ambient range.
Unique Advantages
- Standard SDRAM architecture: 32M x 8 organization provides a straightforward memory map for systems requiring 256 Mbit of volatile storage.
- Deterministic timing: Specified 166 MHz clock frequency and 5.4 ns access time enable predictable synchronous memory performance.
- Low-voltage compatibility: 3.0 V to 3.6 V supply range fits common 3 V system rails without additional power conversion.
- Compact package size: 54-TSOP II (10.16 mm width) supports tighter PCB layouts and higher board density.
- Industry supplier: Manufactured by ISSI, Integrated Silicon Solution Inc, providing traceable device sourcing.
Why Choose IS42S83200L-6TL?
The IS42S83200L-6TL is positioned for designs that require a 256 Mbit synchronous DRAM with defined timing (166 MHz clock, 5.4 ns access) and a 32M x 8 organization. Its LVTTL interface, 3.0–3.6 V supply range, and compact 54-TSOP II package make it suitable for board-level integration where a standard SDRAM solution is needed within a 0°C to 70°C ambient environment.
Engineers selecting this device benefit from clear electrical and mechanical characteristics useful for system-level memory planning, enabling predictable integration for transient data storage and buffering requirements.
For pricing, availability, and to request a quote for IS42S83200L-6TL, please contact sales or submit a quote request through your normal procurement channels.
