IS42S83200L-6TLI
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 43 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | LVTTL | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of IS42S83200L-6TLI – IC DRAM 256MBIT PAR 54TSOP II
The IS42S83200L-6TLI is a 256 Mbit volatile SDRAM organized as 32M × 8. It delivers SDRAM performance with a 166 MHz clock frequency and a 5.4 ns access time in a 54-TSOP II package.
Designed for systems requiring a compact 256 Mbit DRAM device, the part operates from a 3.0 V to 3.6 V supply and across an ambient temperature range of −40°C to 85°C.
Key Features
- Core / Memory — 256 Mbit SDRAM organized as 32M × 8, providing standard DRAM storage density.
- Performance — 166 MHz clock frequency and 5.4 ns access time for fast memory transactions.
- Interface — LVTTL memory interface for compatibility with 3.3 V logic-level systems.
- Power — Operates from a 3.0 V to 3.6 V supply voltage range.
- Package — 54-TSOP II (0.400", 10.16 mm width) surface-mount package for compact board integration.
- Operating Conditions — Rated for ambient temperatures from −40°C to 85°C (TA).
Typical Applications
- Embedded Systems — Provides 256 Mbit SDRAM capacity for embedded designs requiring standard DRAM organization.
- Board-Level Memory Expansion — Fits designs that need a 54-TSOP II package and LVTTL interface at common 3.3 V supply levels.
- Industrial Electronics — Suitable for equipment operating across an ambient temperature range of −40°C to 85°C.
Unique Advantages
- Compact 54-TSOP II footprint: Enables dense PCB layouts with a 10.16 mm package width.
- High-speed SDRAM operation: 166 MHz clock and 5.4 ns access time support time-sensitive memory access.
- Standard LVTTL interface: Simplifies integration with LVTTL-compatible logic systems.
- Flexible supply range: 3.0 V to 3.6 V accommodates typical 3.3 V power rails.
- Wide ambient temperature rating: −40°C to 85°C supports deployment in varied environmental conditions.
Why Choose IS42S83200L-6TLI?
The IS42S83200L-6TLI positions itself as a compact, specification-driven 256 Mbit SDRAM option for designs that require a 32M × 8 memory organization, LVTTL interface, and a 54-TSOP II package. Its 166 MHz clock and 5.4 ns access time make it suitable where defined SDRAM performance and a 3.0 V–3.6 V supply are required.
Manufactured by Integrated Silicon Solution Inc (ISSI), this device provides clear, verifiable electrical and mechanical parameters—allowing engineers to plan board layout, power, and thermal considerations with defined limits.
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