IS42S83200L-7TL-TR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 137 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization32M x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS42S83200L-7TL-TR – IC DRAM 256MBIT PAR 54TSOP II

The IS42S83200L-7TL-TR is a 256 Mbit volatile SDRAM device organized as 32M × 8. It provides synchronous DRAM memory in a 54-TSOP II package and is manufactured by Integrated Silicon Solution Inc.

Designed for board-level memory implementations that require a 256 Mbit SDRAM with LVTTL interface, this device operates from a 3.0 V to 3.6 V supply and is specified for an ambient temperature range of 0°C to 70°C.

Key Features

  • Memory Type & Capacity 256 Mbit volatile SDRAM organized as 32M × 8, delivered in DRAM format.
  • Performance Supports a clock frequency of 143 MHz with an access time of 5.4 ns for timing-sensitive memory operations.
  • Interface LVTTL memory interface for signal compatibility at the device pins.
  • Supply Voltage Operates from 3.0 V to 3.6 V, defining the device's electrical supply range.
  • Package & Mounting 54-TSOP II package (0.400", 10.16 mm width) suitable for compact PCB layouts.
  • Operating Temperature Specified ambient range of 0°C to 70°C (TA).

Typical Applications

  • Embedded systems — System memory where a 256 Mbit SDRAM with LVTTL interface and 3.0–3.6 V supply is required.
  • Consumer electronics — Devices operating within 0°C to 70°C that require compact, board-mounted DRAM in a 54-TSOP II package.
  • Memory module and subsystem design — Integration into PCBs or modules using a standard 32M × 8 memory organization.

Unique Advantages

  • Compact 54-TSOP II package: Enables space-efficient PCB implementations with a 0.400" (10.16 mm) package width.
  • Defined electrical envelope: 3.0 V to 3.6 V supply simplifies power-rail planning for designs targeting this voltage range.
  • Deterministic timing: 143 MHz clock frequency and 5.4 ns access time provide clear timing parameters for system integration.
  • Standard memory organization: 32M × 8 layout facilitates straightforward addressing and mapping in byte-wide memory architectures.
  • Commercial temperature rating: Specified for 0°C to 70°C ambient operation for designs within that range.

Why Choose IS42S83200L-7TL-TR?

The IS42S83200L-7TL-TR offers a compact, board-level 256 Mbit SDRAM solution with clear electrical and timing specifications: 32M × 8 organization, 143 MHz clock, 5.4 ns access time, LVTTL interface, and a 3.0–3.6 V supply range. Its 54-TSOP II package and 0°C to 70°C ambient rating make it suitable for designs that need standardized DRAM capacity and defined operating conditions.

Manufactured by Integrated Silicon Solution Inc., this device provides a straightforward memory option for engineers and procurement teams implementing or expanding DRAM capacity on PCBs where the listed specifications match design requirements.

Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the IS42S83200L-7TL-TR.

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