IS42S83200L-6TLI-TR
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 142 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | LVTTL | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of IS42S83200L-6TLI-TR – 256 Mbit SDRAM, 54‑TSOP II
The IS42S83200L-6TLI-TR is a 256 Mbit volatile DRAM device implemented as SDRAM with a 32M × 8 memory organization. It delivers a clock-frequency rating of 166 MHz and an access time of 5.4 ns for board-level memory expansion in systems that require synchronous DRAM functionality.
Designed in a 54‑TSOP II (0.400", 10.16 mm width) package and operating from a 3.0 V to 3.6 V supply, this device is suitable for designs that need a compact SDRAM component with defined electrical and thermal specifications, including an operating temperature range of −40 °C to 85 °C.
Key Features
- Memory Architecture: 32M × 8 organization providing a total memory size of 256 Mbit in a standard SDRAM configuration.
- SDRAM Technology: Synchronous DRAM implementation supporting system designs that use SDRAM timing and control.
- Performance: Clock frequency specified at 166 MHz with an access time of 5.4 ns, enabling relatively high-speed synchronous memory access.
- Interface: LVTTL memory interface compatible with 3.3 V logic levels.
- Power: Operating supply voltage range of 3.0 V to 3.6 V for typical 3.3 V system integration.
- Package: 54‑TSOP II (0.400", 10.16 mm width) surface-mount package suited for compact PCB layouts.
- Temperature Range: Industrial‑grade operating temperature from −40 °C to 85 °C for a wide range of environmental conditions.
Typical Applications
- Board‑level DRAM modules: Used as a 256 Mbit SDRAM component in printed circuit board memory subsystems requiring a 32M × 8 organization.
- High‑speed buffering: Employed where a 166 MHz clock and 5.4 ns access time are needed for synchronous data buffering and temporary storage.
- 3.3 V logic systems: Integrates into designs using LVTTL interfaces and a 3.0–3.6 V supply for system memory expansion.
Unique Advantages
- Compact 54‑TSOP II package: Enables space-efficient PCB layouts with a 10.16 mm package width.
- Clear electrical window: 3.0 V to 3.6 V supply range aligns with common 3.3 V system rails for straightforward power integration.
- Defined timing performance: 166 MHz clock and 5.4 ns access time provide verifiable synchronous memory performance for timing-sensitive designs.
- Industrial temperature capability: −40 °C to 85 °C operating range supports deployment in varied environmental conditions.
- Standard LVTTL interface: Facilitates direct interfacing with 3.3 V logic families for board-level integration.
Why Choose IS42S83200L-6TLI-TR?
The IS42S83200L-6TLI-TR provides a straightforward SDRAM solution when a 256 Mbit, 32M × 8 memory device is required, combining defined timing (166 MHz, 5.4 ns) with a compact 54‑TSOP II package and a 3.0–3.6 V supply window. Its LVTTL interface and industrial temperature rating make it suitable for designs that need predictable synchronous memory behavior within those electrical and thermal constraints.
This device is appropriate for engineers and procurement teams specifying board‑level SDRAM for systems that require a clear set of electrical, timing, packaging, and temperature specifications. For complete timing diagrams, pin‑out and electrical characteristics consult the manufacturer's datasheet for further design verification.
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