IS43DR16160B-25DBL
| Part Description |
IC DRAM 256MBIT PAR 84TWBGA |
|---|---|
| Quantity | 218 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 84-TWBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 400 ps | Grade | Commercial | ||
| Clock Frequency | 400 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 84-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS43DR16160B-25DBL - 256Mbit DDR2 SDRAM
The IS43DR16160B-25DBL is a 256Mbit DDR2 SDRAM (Double Data Rate Synchronous DRAM) from ISSI, Integrated Silicon Solution Inc. Organized as 16M x 16, this high-performance memory device operates at 400MHz clock frequency and supports a wide voltage range of 1.7V to 1.9V. Designed for commercial temperature applications (0°C to 70°C), it provides reliable parallel memory interface for embedded systems requiring fast data access and efficient power consumption.
Key Features
- High-Speed DDR2 Architecture - 400MHz clock frequency with 0.4ns access time enables rapid data throughput for bandwidth-intensive applications.
- 256Mbit Memory Capacity - 16M x 16 organization provides flexible memory allocation for diverse system requirements.
- Parallel Interface - Direct memory bus connection simplifies integration with microprocessors, FPGAs, and embedded controllers.
- Wide Voltage Operation - 1.7V to 1.9V supply range offers compatibility with various system voltage levels and supports low-power design strategies.
- Compact TWBGA Package - 84-pin TWBGA (8x12.5mm) footprint minimizes board space while providing robust mechanical connection.
- Commercial Temperature Range - 0°C to 70°C operating range suits standard embedded and computing applications.
Typical Applications
- Embedded Computing Systems - This DDR2 SDRAM provides main memory for single-board computers and embedded processors where the 16M x 16 organization matches common data bus widths and the 400MHz operation delivers sufficient bandwidth for real-time processing tasks.
- Networking Equipment - The memory serves as packet buffer storage in routers and switches where fast access times enable efficient data packet handling and the parallel interface simplifies integration with network processors.
- Industrial Control Systems - In programmable logic controllers and industrial PCs, this SDRAM offers reliable data storage for control algorithms and HMI operations within the 0°C to 70°C temperature range typical of controlled industrial environments.
- Consumer Electronics - Set-top boxes, digital displays, and multimedia devices benefit from the 256Mbit capacity for frame buffering and application code storage where the compact TWBGA package conserves valuable PCB space.
- Test and Measurement Instruments - Oscilloscopes, data acquisition systems, and analysis tools utilize this memory for waveform capture and processing where the 400MHz clock supports high sample rate operations.
Unique Advantages
- Proven DDR2 Technology: Mature SDRAM architecture ensures broad ecosystem support with readily available controllers and reduced integration risk compared to newer memory technologies.
- Simplified BOM Management: Standard parallel interface eliminates the need for complex memory controllers required by serial memory solutions, reducing component count and design complexity.
- Cost-Effective Capacity: 256Mbit density strikes an optimal balance between memory requirements and cost for mid-range embedded applications without overprovisioning.
- Flexible Voltage Compatibility: Wide 1.7V-1.9V operating range accommodates various system designs and allows voltage scaling for power optimization.
- Space-Efficient Packaging: TWBGA format delivers higher pin density than traditional packages, enabling compact designs while maintaining reliable electrical connections.
- Active Production Status: Current lifecycle availability ensures long-term supply continuity for new designs and sustained production runs.
Why Choose IS43DR16160B-25DBL?
The IS43DR16160B-25DBL represents a reliable choice for designers seeking proven DDR2 memory technology with commercial temperature operation. Its 400MHz performance level and 256Mbit capacity address the needs of cost-sensitive embedded applications where established SDRAM technology offers lower risk and faster time-to-market compared to cutting-edge memory solutions. The parallel interface simplifies hardware design while the compact TWBGA package supports space-constrained layouts.
For applications operating in controlled environments between 0°C and 70°C, this memory device provides dependable performance backed by ISSI's expertise in memory solutions. The active lifecycle status ensures availability for both new product development and ongoing production requirements.
Get a Quote
Contact our sales team to discuss your memory requirements and receive pricing for the IS43DR16160B-25DBL. Our technical support staff can assist with integration questions and provide additional documentation to accelerate your design process.
