IS43DR16160A-3DBLI-TR
| Part Description |
IC DRAM 256MBIT PAR 84TWBGA |
|---|---|
| Quantity | 1,380 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 84-TWBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 450 ps | Grade | Industrial | ||
| Clock Frequency | 333 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 84-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS43DR16160A-3DBLI-TR - 256Mbit DDR2 SDRAM
The IS43DR16160A-3DBLI-TR is a 256-megabit DDR2 SDRAM memory device from ISSI, Integrated Silicon Solution Inc. Built on advanced synchronous DRAM technology, this parallel interface memory chip delivers reliable data storage and retrieval for embedded systems requiring moderate density and proven DDR2 performance. With a 16M x 16 organization and 333MHz clock frequency, it provides a practical solution for cost-sensitive designs in industrial and consumer applications.
Operating across an industrial temperature range of -40°C to 85°C, this memory device offers robust performance in demanding environments while maintaining a compact 84-pin TWBGA footprint. The device is well-suited for legacy system support and long-lifecycle embedded platforms.
Key Features
- Memory Architecture - 256-megabit capacity organized as 16M x 16, providing flexible word-based access for 16-bit data bus architectures commonly found in embedded processors and microcontrollers.
- DDR2 SDRAM Technology - Delivers 333MHz clock frequency with 4.5ns access time and 15ns write cycle time, balancing performance with power efficiency for mainstream embedded applications.
- Industrial Temperature Range - Operates reliably from -40°C to 85°C, ensuring consistent performance in harsh industrial environments, outdoor equipment, and automotive auxiliary systems.
- Compact Package - 84-pin TWBGA (8mm x 12.5mm) package minimizes PCB footprint while providing a parallel interface for straightforward integration with existing DDR2-compatible controllers.
- Voltage Supply - Operates on 1.7V to 1.9V supply, aligning with standard DDR2 power requirements and enabling compatibility with established DDR2 ecosystem components.
Typical Applications
- Industrial Control Systems - Provides working memory for PLCs, industrial PCs, and motion controllers where extended temperature tolerance and proven DDR2 compatibility ensure reliable operation in factory automation environments.
- Legacy System Maintenance - Serves as a replacement or expansion component for existing DDR2-based platforms, supporting long-lifecycle products that require continued availability of compatible memory devices.
- Embedded Computing - Delivers cost-effective volatile memory for embedded processors in consumer electronics, point-of-sale terminals, and communications equipment where moderate density and parallel interface simplify system design.
- Medical Instrumentation - Supports diagnostic equipment and monitoring devices operating in temperature-controlled environments, providing reliable data buffering for real-time signal processing applications.
Unique Advantages
- Proven DDR2 Compatibility: Integrates seamlessly with existing DDR2 controllers and chipsets, reducing design risk and accelerating time to market for systems based on established architectures.
- Extended Temperature Operation: Industrial temperature rating enables deployment in challenging thermal environments without requiring active cooling or thermal management solutions, reducing system complexity.
- Compact Ball Grid Array: TWBGA package delivers high pin density in a small footprint, conserving valuable PCB real estate in space-constrained designs.
- Parallel Interface Simplicity: Standard DDR2 parallel interface eliminates the need for complex serial protocol controllers, simplifying firmware development and reducing BOM cost.
- Established Ecosystem Support: Benefits from mature DDR2 design tools, reference designs, and controller availability, lowering engineering effort for system integration.
Why Choose IS43DR16160A-3DBLI-TR?
This DDR2 SDRAM is positioned for embedded system designers maintaining or upgrading legacy platforms that rely on proven DDR2 memory technology. The industrial temperature range makes it particularly suitable for equipment deployed in factories, outdoor installations, or transportation systems where ambient conditions vary beyond commercial limits. The compact TWBGA package and moderate density strike a balance between capability and cost-effectiveness.
For long-lifecycle products requiring stable component availability and established technical support, this device offers the reliability of mature SDRAM technology with the performance characteristics needed for mainstream embedded applications. It represents a practical choice for systems where proven compatibility and thermal robustness outweigh the need for cutting-edge memory bandwidth.
Get a Quote Today
Contact our technical sales team to discuss your memory requirements and receive pricing for the IS43DR16160A-3DBLI-TR. Our specialists can assist with component selection, availability confirmation, and integration support for your embedded system design.
