IS43R32400E-5BL
| Part Description |
IC DRAM 128MBIT PAR 144LFBGA |
|---|---|
| Quantity | 607 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-LFBGA (12x12) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 144-LFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS43R32400E-5BL – 128 Mbit SDRAM, 144-LFBGA
The IS43R32400E-5BL is a 128 Mbit volatile DRAM device implemented as SDRAM (DDR) with a parallel memory interface and a 4M × 32 organization. It operates up to a 200 MHz clock frequency and is supplied in a 144-LFBGA (12 × 12) package.
Engineered for systems that require on-board parallel DDR memory with predictable timing and compact packaging, this device offers a defined operating range and electrical profile suitable for integration into standard commercial-temperature applications.
Key Features
- Memory Core 128 Mbit DRAM implemented as SDRAM (DDR) with a 4M × 32 organization, providing parallel data paths for system memory requirements.
- Performance Supports a clock frequency up to 200 MHz with an access time of 700 ps and a word page write cycle time of 15 ns for deterministic timing characteristics.
- Power Nominal supply range of 2.3 V to 2.7 V, enabling operation in low-voltage memory domains.
- Package & Mounting Supplied in a 144-LFBGA package (12 × 12 mm) suitable for surface-mount assembly; MountingType specified as Volatile and MemoryFormat as DRAM.
- Interface & Organization Parallel memory interface with 4M × 32 organization to match wide-data-path system architectures.
- Operating Range Rated for commercial operating temperatures from 0°C to 70°C (TA).
Unique Advantages
- Compact LFBGA footprint: The 144-LFBGA (12 × 12) package minimizes board area while providing a robust surface-mount package option.
- Defined electrical window: Operates across a specified 2.3 V to 2.7 V supply range, simplifying power-supply planning for compatible systems.
- Deterministic timing specs: Published access time (700 ps) and write cycle time (15 ns) allow predictable memory timing analysis during system design.
- Parallel DDR architecture: 4M × 32 organization and parallel interface support wide-data-path designs that require straightforward memory mapping.
- Commercial temperature support: Specified 0°C to 70°C operating range aligns with standard commercial-environment deployments.
Why Choose IS43R32400E-5BL?
The IS43R32400E-5BL positions itself as a compact, parallel DDR SDRAM solution offering a clear set of electrical and timing specifications—128 Mbit capacity, 200 MHz clock support, 700 ps access time, and a 2.3 V–2.7 V supply window. These attributes make it suitable for designs that require a predictable, surface-mount DRAM device in a 144-LFBGA package.
Choose this device for projects that demand a defined commercial operating temperature range and straightforward integration with parallel memory buses, where board space, timing predictability, and low-voltage operation are key considerations.
Request a quote or submit a pricing inquiry for the IS43R32400E-5BL to obtain availability and lead-time information.
