IS45S16160J-6BLA1-TR
| Part Description |
IC DRAM 256MBIT PAR 54TFBGA |
|---|---|
| Quantity | 1,067 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS45S16160J-6BLA1-TR – 256 Mbit Parallel SDRAM, 54‑TFBGA
The IS45S16160J-6BLA1-TR is a 256 Mbit volatile DRAM organized as 16M × 16 using SDRAM technology. It provides a parallel memory interface designed for systems requiring mid-density DRAM with defined timing and electrical characteristics.
Key specifications include a 166 MHz clock frequency, 5.4 ns access time, a supply voltage range of 3.0 V to 3.6 V, and a compact 54‑TFBGA (8×8) package. The device is specified for operation from −40°C to 85°C (TA).
Key Features
- Memory Type & Organization 256 Mbit SDRAM organized as 16M × 16 provides parallel DRAM storage suitable for system memory expansion and buffering.
- Performance Rated for a 166 MHz clock frequency with an access time of 5.4 ns to support time-sensitive read/write operations.
- Interface Parallel memory interface for integration into designs that require standard DRAM signaling and timing.
- Power Operates from 3.0 V to 3.6 V, providing compatibility with 3 V-class power rails.
- Package 54‑TFBGA (8×8) supplier device package for compact board footprint and BGA mounting.
- Temperature Range Specified operation from −40°C to 85°C (TA) for use across a broad ambient temperature range.
Unique Advantages
- Mid-density memory option: 256 Mbit capacity balances storage and board space for systems needing moderate DRAM density.
- Deterministic timing: 5.4 ns access time and 166 MHz clock rating enable predictable memory performance for timing-sensitive designs.
- Standard parallel interface: Parallel SDRAM interface eases integration into existing DRAM controller architectures.
- Wide supply window: 3.0 V to 3.6 V operation supports common 3 V power domains.
- Compact BGA package: 54‑TFBGA (8×8) package minimizes PCB footprint while providing robust soldered connections.
- Extended ambient operation: −40°C to 85°C rating supports deployment in a range of environmental conditions.
Why Choose IS45S16160J-6BLA1-TR?
The IS45S16160J-6BLA1-TR positions itself as a practical SDRAM choice for designs requiring a 256 Mbit parallel memory with defined access timing and a compact BGA footprint. Its combination of 16M × 16 organization, 166 MHz clock support, and 5.4 ns access time offers predictable performance for buffering and system memory tasks.
With a 3.0 V–3.6 V supply range and −40°C to 85°C operating window, this device is suitable for a variety of electronic applications where mid-density volatile memory and a small package are required.
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