IS45S16320F-7CTLA1-TR

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 556 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS45S16320F-7CTLA1-TR - 512Mbit Parallel SDRAM

The IS45S16320F-7CTLA1-TR is a 512Mbit synchronous DRAM from ISSI, Integrated Silicon Solution Inc, configured in a 32M x 16-bit parallel memory architecture. Operating at speeds up to 143MHz, this SDRAM delivers reliable volatile memory performance for embedded systems, computing platforms, and industrial applications. With an extended temperature range of -40°C to 85°C, it provides stable operation in demanding environments while maintaining low power consumption with a 3V to 3.6V supply voltage.

Key Features

  • High-Density Memory Architecture - 512Mbit capacity organized as 32M x 16-bit provides substantial data storage for buffering, caching, and program execution in memory-intensive applications.
  • Fast Access Performance - 5.4ns access time and 143MHz clock frequency enable rapid data retrieval for real-time processing and high-throughput operations.
  • Parallel Interface - Direct parallel memory interface simplifies integration with processors, FPGAs, and controllers without requiring complex serial-to-parallel conversion circuitry.
  • Extended Temperature Range - -40°C to 85°C operating temperature supports reliable performance in industrial control systems, automotive applications, and outdoor installations.
  • Standard Supply Voltage - 3V to 3.6V operation aligns with common embedded system power rails, reducing the need for additional voltage regulation.
  • 54-TSOP II Package - Thin small-outline package (10.16mm width) offers a space-efficient footprint for compact PCB designs while maintaining thermal performance.

Typical Applications

  • Industrial Automation - This SDRAM provides reliable memory for PLCs, HMI systems, and motion controllers where the extended temperature tolerance ensures consistent operation in factory floor environments and the parallel interface enables straightforward integration with industrial processors.
  • Embedded Computing - Serves as main system memory or frame buffer memory in embedded computers, single-board computers, and industrial PCs where the 512Mbit capacity supports complex firmware and operating system requirements.
  • Communications Equipment - Functions as packet buffer memory in routers, switches, and network appliances where fast access times enable efficient data throughput and the extended temperature range supports installations in uncontrolled environments.
  • Test and Measurement Instruments - Provides data acquisition buffer memory in oscilloscopes, logic analyzers, and data loggers where the high-speed parallel interface supports real-time capture of measurement data.
  • Medical Devices - Offers working memory for medical imaging equipment, patient monitors, and diagnostic instruments where reliable performance across temperature variations ensures consistent device operation.

Unique Advantages

  • Simplified Integration with Legacy Designs: Parallel interface provides drop-in compatibility with existing systems using traditional memory architectures, reducing redesign effort when upgrading or replacing components.
  • Reduced External Component Count: Direct parallel connection eliminates interface conversion ICs, lowering BOM costs and simplifying PCB routing compared to serial memory solutions.
  • Wide Operating Window: Extended -40°C to 85°C temperature range eliminates the need for additional thermal management in industrial and harsh-environment applications, reducing system complexity and cost.
  • Proven SDRAM Technology: Synchronous DRAM architecture provides predictable timing and well-established controller support across a wide range of processors and FPGAs, accelerating development cycles.
  • Active Lifecycle Status: Current production availability ensures long-term component sourcing for products with extended service lives and reduces risk of redesign due to obsolescence.
  • Standard Tape and Reel Packaging: TR suffix indicates tape and reel packaging that supports automated pick-and-place assembly, improving manufacturing throughput and reducing handling costs.

Why Choose IS45S16320F-7CTLA1-TR?

The IS45S16320F-7CTLA1-TR is an excellent choice for system designers who need dependable parallel SDRAM with industrial-grade temperature performance. Its 512Mbit capacity and fast access times suit applications ranging from embedded computing to industrial control, while the parallel interface simplifies integration with processors and controllers that support traditional memory buses. The extended temperature range makes it particularly well-suited for industrial automation, outdoor installations, and other environments where ambient conditions vary significantly.

With active lifecycle status and tape and reel packaging, this SDRAM supports both new product development and long-term manufacturing requirements. Engineers selecting this component benefit from ISSI's established position in the memory market and the widespread compatibility of standard SDRAM technology across development tools and platforms.

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