IS45S16800F-6TLA1
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 31 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S16800F-6TLA1 – IC DRAM 128MBIT PAR 54TSOP II
The IS45S16800F-6TLA1 is a 128 Mbit volatile SDRAM organized as 8M × 16 with a parallel memory interface. It offers a 166 MHz clock rating and a 5.4 ns access time, suitable for designs that require mid‑range SDRAM performance in a compact 54‑TSOP II package.
This device operates from a 3.0 V to 3.6 V supply and supports an ambient temperature range of −40°C to 85°C, making it appropriate for systems needing stable DRAM storage across commercial and industrial temperature conditions.
Key Features
- Memory Type & Technology Volatile SDRAM offering 128 Mbit of storage in a DRAM format.
- Organization Internal memory organized as 8M × 16, enabling 16‑bit wide parallel data transfers.
- Performance Rated for a 166 MHz clock frequency with a typical access time of 5.4 ns to support time‑sensitive memory operations.
- Voltage Supply Operates from 3.0 V to 3.6 V supply voltage.
- Package Supplied in a 54‑lead TSOP II package (0.400" / 10.16 mm width) suitable for space‑constrained board layouts.
- Temperature Range Specified for operation from −40°C to 85°C (TA) to accommodate a broad range of ambient conditions.
- Interface Parallel memory interface for straightforward integration into parallel SDRAM memory buses.
Unique Advantages
- Compact TSOP II footprint: The 54‑lead TSOP II package (10.16 mm width) provides a space‑efficient form factor for board designs with limited area.
- Mid‑range clock performance: 166 MHz clock rating and 5.4 ns access time deliver responsive SDRAM performance for systems requiring moderate bandwidth.
- 16‑bit data organization: 8M × 16 memory organization supports wider parallel data transfers, simplifying data path design in 16‑bit systems.
- Wide operating temperature: −40°C to 85°C rating helps ensure consistent operation across varied ambient environments.
- Standard 3.0–3.6 V operation: Compatible with common 3.3 V system rails for straightforward power supply integration.
Why Choose IC DRAM 128MBIT PAR 54TSOP II?
The IS45S16800F-6TLA1 positions itself as a practical SDRAM option where a 128 Mbit parallel memory with 16‑bit organization is required. Its combination of 166 MHz clock capability, 5.4 ns access time, and a compact 54‑TSOP II package supports designs that need balanced performance and board‑space efficiency.
This part is suited to customers and designs that require a standard 3.0–3.6 V SDRAM device rated for extended temperature operation (−40°C to 85°C). It offers a clear specification set for predictable integration into parallel memory subsystems.
Request a quote or contact sales to obtain pricing, availability, and further technical assistance for IS45S16800F-6TLA1.
