IS45S16800F-6CTLA1-TR
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 185 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S16800F-6CTLA1-TR – IC DRAM 128MBIT PAR 54TSOP II
The IS45S16800F-6CTLA1-TR is a 128 Mbit volatile SDRAM device organized as 8M × 16 with a parallel memory interface. It delivers synchronous DRAM operation with a 166 MHz clock frequency and a 5.4 ns access time for applications that require fast, byte-parallel memory access.
Packaged in a 54‑TSOP II (0.400", 10.16 mm width), the device supports a 3.0 V to 3.6 V supply range and an operating temperature of -40°C to 85°C, making it suitable for designs needing compact board-level memory with defined performance and temperature range.
Key Features
- Memory Core 128 Mbit SDRAM organized as 8M × 16, providing parallel data paths for system memory and buffering.
- Performance 166 MHz clock frequency with a 5.4 ns access time to support responsive memory transactions.
- Interface Parallel memory interface compatible with standard parallel SDRAM controllers and legacy memory architectures.
- Power Supply voltage range of 3.0 V to 3.6 V to match common 3.3 V system power rails.
- Package 54‑TSOP II package (0.400", 10.16 mm width) for compact, surface-mount board designs.
- Operating Range Specified operating temperature from -40°C to 85°C (TA), supporting a wide ambient temperature range.
Typical Applications
- Embedded system memory — Used as main or auxiliary SDRAM in embedded platforms that require 128 Mbit of parallel volatile memory.
- Buffer and frame memory — Suitable for buffering data in subsystems that rely on parallel SDRAM access and 16‑bit data width.
- Legacy parallel memory systems — Drop-in-compatible option for designs and equipment employing parallel SDRAM interfaces and standard 54‑TSOP II footprint.
Unique Advantages
- Deterministic performance: 166 MHz clock and 5.4 ns access time provide clearly defined timing for system memory design and timing closure.
- Compact TSOP II packaging: 54‑pin TSOP II (0.400", 10.16 mm) minimizes board area while preserving standard pinout for parallel SDRAM.
- Wide voltage compatibility: 3.0 V to 3.6 V supply range aligns with common 3.3 V system rails for simplified power design.
- Broad operating temperature: Specified -40°C to 85°C operating range supports deployment across varied ambient conditions.
- Parallel 16-bit organization: 8M × 16 organization enables 16‑bit wide data transfers for straightforward integration with 16‑bit memory buses.
Why Choose IS45S16800F-6CTLA1-TR?
The IS45S16800F-6CTLA1-TR combines a 128 Mbit SDRAM architecture with a parallel 8M × 16 organization and defined timing characteristics (166 MHz clock, 5.4 ns access time), making it well suited to designs that need predictable, parallel volatile memory in a compact TSOP II package. Its 3.0–3.6 V supply range and -40°C to 85°C operating window provide compatibility with common system power rails and a wide ambient temperature envelope.
This device is appropriate for engineers specifying board-level SDRAM for embedded systems, buffer memory, or legacy parallel memory applications where footprint, voltage compatibility, and clear timing specifications are primary considerations.
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