IS45S16800E-7TLA2-TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 877 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeAutomotive
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS45S16800E-7TLA2-TR – 128Mbit SDRAM, 54‑TSOP II, 143 MHz

The IS45S16800E-7TLA2-TR is a 128Mbit synchronous DRAM (SDRAM) device organized as 8M × 16 with a quad-bank architecture and a fully synchronous, pipelined interface. It is designed for high-speed data transfer with all signals referenced to the rising edge of the clock and an LVTTL-compatible interface.

This SDRAM suits designs that require predictable, high-throughput parallel memory—providing programmable burst lengths and CAS latencies, internal bank management for row access/precharge hiding, and on-chip refresh mechanisms to support continuous operation across a broad temperature range.

Key Features

  • Memory Core 128Mbit SDRAM organized as 8M × 16 bits across four internal banks, enabling concurrent bank operation and efficient row management.
  • Performance & Timing Operates up to 143 MHz (‑7 speed grade) with an access time from clock of 5.4 ns (CAS latency = 3). Programmable CAS latency options include 2 and 3 clocks.
  • Burst & Sequencing Programmable burst lengths (1, 2, 4, 8, full page) and selectable sequential or interleave burst sequences for flexible data transfer patterns.
  • Refresh & Power Modes Supports auto refresh (CBR) and self refresh; device offers 4096 refresh cycles per interval depending on grade. Includes power-saving power-down and self-refresh capabilities.
  • Interface Parallel LVTTL-compatible interface with random column address capability every clock cycle for predictable column accesses.
  • Voltage & Supply Designed for 3.3 V operation; documented operating supply range includes 3.0 V to 3.6 V.
  • Temperature Range Specified for operation from −40°C to +105°C (TA) for the high-temperature option.
  • Package 54-pin TSOP II package (0.400", 10.16 mm width) for compact board-level footprint and standard surface-mount assembly.

Typical Applications

  • High-speed buffering Parallel SDRAM buffering where predictable synchronous timing and programmable burst transfers are required.
  • Embedded system memory System memory expansion in designs that need 128 Mbit of volatile SDRAM with a parallel LVTTL interface.
  • Data capture and frame storage Temporary storage for streaming data where internal bank interleaving and burst modes improve throughput.

Unique Advantages

  • Deterministic synchronous operation: All signals referenced to the rising edge of the clock, enabling tight timing control and predictable data transfers.
  • High-throughput capability: 143 MHz clock operation with 5.4 ns access from clock at CAS = 3 supports fast read/write cycles.
  • Flexible data handling: Programmable burst lengths and burst sequencing allow tuning for sequential or interleaved access patterns.
  • Built-in refresh and power modes: Auto refresh and self-refresh plus power-down reduce external management and support low-power idle states.
  • Wide operating temperature: Specified operation from −40°C to +105°C supports deployment in temperature-challenging environments.
  • Standard TSOP II footprint: 54-pin TSOP II package provides a compact, industry-standard surface-mount option for board-level integration.

Why Choose IS45S16800E-7TLA2-TR?

The IS45S16800E-7TLA2-TR combines a synchronous, pipelined SDRAM architecture with programmable timing and burst options to give designers deterministic performance and flexible data-transfer modes. Its 8M × 16 organization and quad-bank structure enable efficient row management and concurrent operations suited to high-throughput parallel memory requirements.

This device is appropriate for engineers and procurement teams seeking a 128 Mbit SDRAM in a compact 54‑pin TSOP II package with documented timing (143 MHz, 5.4 ns access), LVTTL interface compatibility, on-chip refresh support, and a broad operating temperature range for robust system-level deployment.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the IS45S16800E-7TLA2-TR.

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