IS45S16800E-7TLA1-TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 109 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS45S16800E-7TLA1-TR – IC DRAM 128Mbit, 54‑TSOP II

The IS45S16800E-7TLA1-TR is a 128Mbit synchronous DRAM (SDRAM) organized as 8M × 16 with a parallel memory interface. It implements a pipelined, fully synchronous architecture with internal bank management and LVTTL-compatible signals referenced to the positive edge of the clock.

Designed for systems that require high-speed, low-latency volatile memory, this device provides programmable burst modes, selectable CAS latency, and refresh modes to support a range of synchronous memory applications operating from a 3.0 V to 3.6 V supply and an operating temperature range of -40 °C to +85 °C.

Key Features

  • Memory Architecture 128 Mbit SDRAM organized as 8M × 16 with quad-bank internal configuration to support concurrent row access and precharge hiding.
  • Synchronous, Pipelined Operation Fully synchronous operation with all signals referenced to the rising clock edge and pipeline architecture for high-speed data transfer.
  • Performance Rated for a 143 MHz clock frequency (‑7 speed grade) with an access time from clock of 5.4 ns (CAS latency = 3).
  • Flexible Burst and CAS Control Programmable burst lengths (1, 2, 4, 8, full page) and programmable burst sequence (sequential/interleave); CAS latency selectable between 2 and 3 clocks.
  • Refresh and Power Modes Supports Auto Refresh, Self Refresh and CBR; datasheet specifies 4096 refresh cycles every 16 ms (A2 grade) or 64 ms (A1 grade).
  • Interface and Signaling Parallel memory interface with LVTTL-compatible I/O signaling and support for random column address every clock cycle.
  • Power and Supply Operates from a 3.0 V to 3.6 V supply (typical VDD/VDDQ 3.3 V as described in the datasheet).
  • Package and Temperature Available in a 54-pin TSOP II package (0.400", 10.16 mm width) with an operating ambient temperature range of -40 °C to +85 °C (TA).

Typical Applications

  • High‑speed system memory Serves as synchronous volatile memory for systems that require pipeline access and programmable latency.
  • Data buffering and streaming Programmable burst lengths and interleave/sequential sequences support burst read/write operations for streaming data buffers.
  • Embedded and industrial equipment 3.0 V–3.6 V supply range and extended temperature operation allow deployment in temperature-challenged environments.

Unique Advantages

  • High-speed synchronous operation: 143 MHz clock rating (‑7) with pipelined architecture provides fast, predictable timing for synchronous designs.
  • Low-latency access: 5.4 ns access time from clock (CAS latency = 3) supports tight timing requirements in performance-sensitive applications.
  • Programmable burst and CAS flexibility: Multiple burst lengths and CAS latency options let designers tune throughput and latency to match system needs.
  • Robust refresh and power features: Auto Refresh, Self Refresh and CBR support preserve data integrity while enabling power-saving modes.
  • Standard TSOP II packaging: 54-pin TSOP II (10.16 mm width) provides a common surface-mount footprint for board-level integration.
  • Wide supply and temperature range: 3.0 V–3.6 V operation and -40 °C to +85 °C ambient rating accommodate a variety of system power and environmental conditions.

Why Choose IS45S16800E-7TLA1-TR?

The IS45S16800E-7TLA1-TR delivers a compact 128 Mbit SDRAM solution with a fully synchronous, pipelined architecture and programmable timing features that support high-speed data transfer and configurable latency. Its 8M × 16 organization, selectable CAS latencies, and burst control make it suitable for designs that require predictable synchronous memory behavior.

With standard 54‑pin TSOP II packaging, LVTTL-compatible signaling, and support for standard refresh and low-power modes, this device is aimed at designs needing a reliable, high-performance parallel DRAM component operating from a 3.0 V–3.6 V supply across an extended temperature range.

Request a quote or submit an inquiry for IS45S16800E-7TLA1-TR to evaluate suitability for your next design project.

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