IS45S16800E-7BLA2

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 1,135 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeAutomotive
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS45S16800E-7BLA2 – IC DRAM 128MBIT PAR 54TFBGA

The IS45S16800E-7BLA2 is a 128 Mbit synchronous DRAM (SDRAM) organized as 8M × 16 with a fully synchronous, pipelined architecture. It provides parallel memory access with programmable burst operation and CAS latency options for deterministic, clock-referenced data transfers.

Designed for systems that require a compact, high-speed volatile memory device, this SDRAM offers selectable performance modes, internal bank architecture for row access/precharge hiding, and a compact 54-ball TFBGA package suitable for space-constrained boards.

Key Features

  • Core & Architecture  Quad-bank SDRAM with pipelined operation; all inputs and outputs are referenced to the rising edge of the clock for fully synchronous operation.
  • Memory Capacity & Organization  128 Mbit total capacity, organized as 8M × 16 bits (2,048K words × 16) to support parallel data paths.
  • Performance  -7 speed grade with 143 MHz clock frequency and 5.4 ns access time (CAS latency = 3). Programmable CAS latency options of 2 or 3 clocks.
  • Burst & Sequencing  Programmable burst length (1, 2, 4, 8, full page) and selectable burst sequence (sequential or interleave) for flexible transfer patterns.
  • Refresh & Power Management  Auto Refresh (CBR) and Self Refresh support with specified refresh cycles (4096 cycles per refresh window dependent on grade) to maintain data integrity in volatile operation.
  • Interface  Parallel memory interface with LVTTL-compatible signals and random column address every clock cycle for efficient read/write access.
  • Voltage & Supply  VDD / VDDQ nominal 3.3 V with an operating supply range of 3.0 V to 3.6 V.
  • Package & Mounting  54-ball TFBGA (8 × 8) compact package for surface-mount assembly.
  • Operating Temperature  Extended ambient temperature range from −40°C to +105°C (TA) for temperature-tolerant applications.

Typical Applications

  • High-speed system memory  Use where a fully synchronous SDRAM with 143 MHz operation and programmable CAS latency is required for deterministic data transfers.
  • Embedded and industrial systems  Suited to boards operating across a wide ambient temperature range (−40°C to +105°C), providing reliable volatile storage in industrial environments.
  • Memory subsystems and buffering  Programmable burst lengths and internal bank architecture make the device appropriate for parallel buffering and burst-oriented transfer patterns.

Unique Advantages

  • Deterministic synchronous interface: All signals referenced to the positive clock edge for predictable timing across system designs.
  • Flexible performance scaling: Selectable CAS latency (2 or 3) and multiple burst lengths enable trade-offs between throughput and latency.
  • Efficient bank architecture: Internal quad-bank design hides row access/precharge latencies to improve effective throughput for burst accesses.
  • Wide operating temperature: −40°C to +105°C rating supports deployment in thermally demanding environments.
  • Compact BGA footprint: 54-ball TFBGA (8×8) reduces board area for space-constrained applications.

Why Choose IS45S16800E-7BLA2?

The IS45S16800E-7BLA2 combines a 128 Mbit SDRAM organization with a fully synchronous, pipelined architecture and programmable timing to deliver predictable, high-speed parallel memory operation. Its selectable CAS latency, burst control, and internal bank structure provide designers with configurable performance options to match system requirements.

With a 3.0 V–3.6 V supply range, LVTTL interface, and a compact 54-ball TFBGA package rated for −40°C to +105°C, this device is well suited to designs that need a compact, temperature-tolerant volatile memory solution with flexible timing and burst capabilities.

Request a quote or submit an inquiry for IS45S16800E-7BLA2 to receive pricing and lead-time information tailored to your procurement needs.

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